Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Kwang-Joo Lee"'
Autor:
Chang-Young Lee, Su Y. Choi, Ye Jun Oh, Kwan-Sup Lee, Kwang-Joo Lee, Jeong-Min Jo, Seok Y. Lee
Publikováno v:
IEEE Access, Vol 8, Pp 52443-52451 (2020)
As a maglev levitates with a small air gap and runs very fast, securing the levitation system's stability is crucial. Thus, the high-performance decoupling control between the propulsion control system and the levitation system is of critical importa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7f9e83f30556c1893f17147e7f872ab6
https://ieeexplore.ieee.org/document/9037286/
https://ieeexplore.ieee.org/document/9037286/
Autor:
Kwang-Seong Choi, Kwang-Joo Lee, Jiho Joo, Yong-Sung Eom, Kim Ju Hyeon, Jung Hak Kim, Seok Hwan Moon
Publikováno v:
3DIC
Laser-Assisted Bonding with Compression (LABC) technology with NCF was proposed to accomplish the productivity and process reliability at the same time. A quartz block as a header was used to deliver a pressure to the devices because of its extremely
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fca51551d44106271bc472d81c65d508
https://doi.org/10.1109/3dic48104.2019.9058890
https://doi.org/10.1109/3dic48104.2019.9058890
Autor:
Seok Hwan Moon, Jiho Joo, Geun-Sik Ahn, Yong-Sung Eom, Kim Ju Hyeon, Gil-Sang Yoon, Kwang-Joo Lee, Chul-Hee Lee, Kwang-Hee Lee, Jung Hak Kim, Kwang-Seong Choi, Moo-Sup Shim, leeseul Jeong
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A LABC (Laser-Assisted Bonding with Compression) bonder and NCF (Non-Conductive Film) were developed to increase the productivity of the bonding process for the advanced microelectronic packaging technology. The design features of a LABC make its UPH
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3d361c203a7cfa98178b42f92ac8da3
https://doi.org/10.1109/ectc.2019.00037
https://doi.org/10.1109/ectc.2019.00037
Autor:
Junmo Kim, Tae-Ik Lee, You-Jin Kyung, Taek-Soo Kim, SangMyung Shin, Jeong Minsu, Kyung-Wook Paik, Kwang-Joo Lee, HanMin Lee
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Fan-Out Packages (FOPs) technology is actively researched because it enables high Input / Output (I/O) pads density, thin package, and cost reduction. Epoxy Molding Compound (EMC) materials play a major role in implementing FOPs. EMC acts as a substr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0301def84685d68b854b68716b47a8d
https://doi.org/10.1109/ectc.2019.00177
https://doi.org/10.1109/ectc.2019.00177
Autor:
Kwang-Joo Lee, SeYoung Lee, HanMin Lee, JongHo Park, You-Jin Kyung, Kyung-Wook Paik, Jung Hak Kim
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Recently, the fan out semiconductor packaging technology has been developed due to the demand for miniaturization and high performance of package products. The Wafer or Panel-Level Fan-Out Packages (FOPs) without package substrates such as Printed Ci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59ca8c3f71d9361763a5f93310b048e2
https://doi.org/10.1109/ectc.2018.00111
https://doi.org/10.1109/ectc.2018.00111
Autor:
Hyun-Tae Kim, Won-Young Han, In Youl Baek, Sang-Ouk Shin, Jong-Min Ko, Keum-Yong Park, Kwang-Joo Lee, Young-Taek Yang, Min-Jung Soe, In-Kwan Song, Young-Hoon Lee, Byung-Won Lee, Myung-Gi Jeon, Yong-Duck Kim
Publikováno v:
Korean Journal of Breeding Science. 44:627-632
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e783ab091dbc21b60bdf92a970d1154
https://doi.org/10.9787/kjbs.2012.44.4.627
https://doi.org/10.9787/kjbs.2012.44.4.627
Publikováno v:
The Review of Business History. 24:239-372
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f31b49c0385a6ca07175c4592100655e
https://doi.org/10.22629/kabh.2009.24.3.008
https://doi.org/10.22629/kabh.2009.24.3.008
Publikováno v:
Life-Cycle Civil Engineering ISBN: 9780429207259
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48c96a7d826313e9eaec74268cf6ac34
https://doi.org/10.1201/9780203885307-97
https://doi.org/10.1201/9780203885307-97
Publikováno v:
2006 International Forum on Strategic Technology.
This paper proposes the high performance tractive force control method of propulsion control system for electric railway vehicles. Using the PWM method progressed in the propulsion control system for electric railway vehicles, the harmonics of output
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::527a747b5c2f61dbee994902cc510d98
https://doi.org/10.1109/ifost.2006.312355
https://doi.org/10.1109/ifost.2006.312355