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Autor:
Ronald N. Reece, Kwang-Chul Joo, Dong-Ho Lee, KyungWon Lee, Sang Wook Park, Sungki Kim, Chul‐Young Ham, Noh-Yeal Kwak, Peter Frisella, Sungki Park, B. Jacobs, G. Cai
Publikováno v:
2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors.
This paper presents a method to minimize cross-wafer threshold voltage variation, specifically radial variation, on device wafers using the inherent characteristics and repeatability of a bell-jar hot wall RTP system. The temperature uniformity of Ax
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6bd42b1f34d9e938156e3775cd66cf0c
https://doi.org/10.1109/rtp.2006.368010
https://doi.org/10.1109/rtp.2006.368010
