Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Kwang Jae Yoo"'
Autor:
Ho Won Lee, Kwang Jae Yoo, Minh Tien Tran, In Yong Moon, Young-Seok Oh, Seong-Hoon Kang, Dong-Kyu Kim
Publikováno v:
Materials, Vol 12, Iss 18, p 2862 (2019)
In the present study, we have investigated the effect of post-welding heat treatment (PWHT) of quenching and tempering (QT) on the microstructure and mechanical properties of welded boron steel joints processed using laser-arc hybrid welding on two c
Externí odkaz:
https://doaj.org/article/2e05c49d0f4843c9af3e5d5430540d5e
Autor:
In Yong Moon, Se-Jong Kim, Howon Lee, Youngseok Oh, Seong-Hoon Kang, Kwang Jae Yoo, Young Hoon Moon
Publikováno v:
Journal of Mechanical Science and Technology. 35:679-687
The ability to reduce the friction resistance between water and solid surface is one of the key functions of superhydrophobic surfaces. Reducing the frictional resistance between a solid surface and water is called drag reduction. This function is in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::169bc0837c2ce3ae28994ad09c8d36dd
https://doi.org/10.1007/s12206-021-0128-9
https://doi.org/10.1007/s12206-021-0128-9
Autor:
Youngseok Oh, Seong-Hoon Kang, In Yong Moon, Kwang Jae Yoo, Minh Tien Tran, Dong-Kyu Kim, Howon Lee
Publikováno v:
Materials
Volume 12
Issue 18
Materials, Vol 12, Iss 18, p 2862 (2019)
Volume 12
Issue 18
Materials, Vol 12, Iss 18, p 2862 (2019)
In the present study, we have investigated the effect of post-welding heat treatment (PWHT) of quenching and tempering (QT) on the microstructure and mechanical properties of welded boron steel joints processed using laser-arc hybrid welding on two c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f944a014ef39e087157ec1ac0257e622
https://doi.org/10.3390/ma12182862
https://doi.org/10.3390/ma12182862
Autor:
Kwang-Jae Yoo, Kyung-Hyun Kim, Jeong-Taek Kong, Bo-Yeon Yoon, Young-Kwan Park, Sang-Rok Ha, Yoo-Hyon Kim
Publikováno v:
2000 International Conference on Simulation Semiconductor Processes and Devices (Cat. No.00TH8502).
Simulation of chemical-mechanical polishing is important because the chip-level planarity and wafer-level uniformity dependent on many dynamic factors are difficult to control. CHAMPS (chemical mechanical planarization simulator) has been developed f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c7c9a85433aa4476e92ab0067c468c6
https://doi.org/10.1109/sispad.2000.871223
https://doi.org/10.1109/sispad.2000.871223
Autor:
Yoo-Hyon Kim, Kwang-Jae Yoo, Kyung-Hyun Kim, Bo-Yeon Yoon, Young-Kwan Park, Sang-Rok Ha, Jeong-Taek Kong
Publikováno v:
2000 International Conference on Simulation Semiconductor Processes & Devices (Cat. No.00TH8502); 2000, p123-126, 4p
Conference
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