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pro vyhledávání: '"Kwang Hyuk Ko"'
Autor:
Chung Gon Yoo, Hyoun Woo Kim, Sang Don Choi, Kwang Hyuk Ko, Je Ho Woo, Chang Jin Kang, J. G. Lee, Nam Ho Kim, Han Sup Lee, Chin-Wook Chung, Dae Kyu Choi, Ju Hyun Myung, Se-Geun Park, Wan Jae Park
Publikováno v:
Thin Solid Films. :222-224
We have studied the characteristics of photoresist (PR) ashing using N 2 /O 2 plasmas in ferrite-core inductively coupled plasma etcher. By varying the O 2 /(O 2 + N 2 ) gas flow ratio, we have changed the PR ash rate and the low-k material etch rate