Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Kwan-Yu Lai"'
Autor:
Rachel Lu, Yu-Hua Chen, Dyi-Chung Hu, Ravindra Vaman Shenoy, Aric Shorey, Urmi Ray, Kwan-Yu Lai, Shaun Hsu, Windsor Pipes Thomas
Publikováno v:
International Symposium on Microelectronics. 2014:000397-000401
For high density interconnection IC packages of the future, the outlook is for thinner packages with higher routing densities. With that, managing the substrate warpage becomes critical. Traditional organic substrates may face several challenges for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d04a064e971b2518184a9ee3aaa68a0c
https://doi.org/10.4071/isom-wa15
https://doi.org/10.4071/isom-wa15
Publikováno v:
ECS Transactions. 61:183-190
Over the next several years, the semiconductor roadmap presents several disruptive challenges: the cost structure in terms of normalized cost per gate is changing dramatically. The conventional cost reduction from one node to the next is diminishing.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::600bd1598315d5518f7a7a9915d4a025
https://doi.org/10.1149/06103.0183ecst
https://doi.org/10.1149/06103.0183ecst
Publikováno v:
2014 IEEE Radio Frequency Integrated Circuits Symposium.
In this paper, we demonstrate the fabrication and characterization of various 3D solenoid inductors using a glass core substrate. Solenoid inductors were fabricated in glass by drilling through holes in glass and semi-additive copper plating for meta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bdfcff1edb6b700e535a7e72178b4ab
https://doi.org/10.1109/rfic.2014.6851696
https://doi.org/10.1109/rfic.2014.6851696
Autor:
Kwan-yu Lai, Stark, Jefferey G.
Publikováno v:
Solid State Technology. Aug2009, Vol. 52 Issue 8, p18-20. 3p.
Publikováno v:
Archives of Environmental & Occupational Health. 2017, Vol. 72 Issue 6, p366-367. 2p.
Autor:
Gupta, Aditya, Lin, Fujiang
Publikováno v:
2014 IEEE Radio Frequency Integrated Circuits Symposium; 2014, p1-1, 1p
Publikováno v:
2014 IEEE Radio Frequency Integrated Circuits Symposium; 2014, p1-100, 100p
Publikováno v:
2014 IEEE Radio Frequency Integrated Circuits Symposium; 2014, p1-22, 22p
Publikováno v:
2014 IEEE Radio Frequency Integrated Circuits Symposium; 2014, p1-104, 104p
Publikováno v:
2014 IEEE Radio Frequency Integrated Circuits Symposium; 2014, p1-18, 18p