Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Kuo-Yu Tseng"'
Publikováno v:
Applied Sciences, Vol 6, Iss 7, p 202 (2016)
This paper describes the fabrication of a series of micro ball-ended stylus tips by applying micro-EDM (Electrical Discharge Machining) and OPED (One Pulse Electrical Discharge) processes, followed by a manual assembly process of a static tri-switche
Externí odkaz:
https://doaj.org/article/9c9d2dbdc90444cdb7e45881177f5ea6
Autor:
Kuo-Yu Tseng, 曾國祐
102
Currently, the daily meals in the military are provided by the solders. Due to the changes of reconstruction of human resource and the changes of the military service system recently, the military need to use outsourcing food vendors for the
Currently, the daily meals in the military are provided by the solders. Due to the changes of reconstruction of human resource and the changes of the military service system recently, the military need to use outsourcing food vendors for the
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/xhegk2
Publikováno v:
Applied Sciences; Volume 6; Issue 7; Pages: 202
Applied Sciences, Vol 6, Iss 7, p 202 (2016)
Applied Sciences, Vol 6, Iss 7, p 202 (2016)
This paper describes the fabrication of a series of micro ball-ended stylus tips by applying micro-EDM (Electrical Discharge Machining) and OPED (One Pulse Electrical Discharge) processes, followed by a manual assembly process of a static tri-switche
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3aedcabaa51662bed24e4f5806dfde16
Publikováno v:
APNOMS
Cloud Service is a major project that CHT currently initiated to promote. It aims to provide services to users anytime and anywhere. To achieve that, we need robust cloud technology. This paper takes FMS (Fraud Management System) as an example to dep
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::150cee0e9799a16829a5ef68a8a811d6
https://doi.org/10.1109/apnoms.2012.6356075
https://doi.org/10.1109/apnoms.2012.6356075
Publikováno v:
Proceedings of IEEE Sensors, 2004..
We present a novel platform technology, EPIES (electroplating and isotropic etching silicon), for integrated RF-MEMS system-on-chip. Thick Cu structures were deposited by electroplating and released by using XeF/sub 2/ isotropic Si etching to remove
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15b12845c981be146cc5ca5b769e2ae4
https://doi.org/10.1109/icsens.2004.1426241
https://doi.org/10.1109/icsens.2004.1426241
Autor:
Kuo-Yu Tseng, Dong Yea Sheu
Publikováno v:
Proceedings of JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment : IIP/ISPS joint MIPE. 2015:WeD-1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7945766e0bcb339dd8169a0cc16f7f0c
https://doi.org/10.1299/jsmemipe.2015._wed-1-1-1
https://doi.org/10.1299/jsmemipe.2015._wed-1-1-1
Publikováno v:
Applied Sciences (2076-3417); Jul2016, Vol. 6 Issue 7, p202, 11p
Autor:
Ju-Chi Tseng, Hsin-Cheng Tseng, Chih-Wei Liu, Chia-Chun Shih, Kuo-Yu Tseng, Cheng-Yu Chou, Chia-Hsuan Yu, Fang-Sun Lu
Publikováno v:
2013 15th Asia-Pacific Network Operations & Management Symposium (APNOMS); 2013, p1-3, 3p
Publikováno v:
Proceedings of IEEE Sensors, 2004; 2004, p615-615, 1p