Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Kuo-Chyuan Chen"'
Autor:
Wen-Wei Shen, Xiao Liu, Yu-Min Lin, Ramachandran Trichur, Yu-Lan Lu, Jay Su, Huan-Chun Fu, Kuan-Neng Chen, Alvin Lee, Kuo-Chyuan Chen, Dongshun Bai, Baron Huang, Tao-Chih Chang, Hsiang-Hung Chang, Chia-Wei Chiang
Publikováno v:
International Symposium on Microelectronics. 2016:000190-000195
With increasing demand for mobile devices to be lighter and thinner and consume less power while operating at high speed and high bandwidth, many equipment suppliers and assembly participants have invested great efforts to achieve fine-line fan-out w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fd3bad740a58fa83d46e9fac1561069
https://doi.org/10.4071/isom-2016-wa34
https://doi.org/10.4071/isom-2016-wa34
Autor:
Kuo-Chyuan Chen, Hsiang-Hung Chang, Yuan-Chang Lee, Ching-Kuan Lee, Yung Jean Rachel Lu, Jen-Chun Wang, Chia-Wen Fan, Wen-Wei Shen, Huan-Chun Fu, Chau-Jie Zhan
Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In this paper, we investigate reliability testing for a glass interposer. The test vehicle is an assembled glass interposer with a chip, a BT substrate. The structure of a glass interposer with two redistribution layers (RDLs) on the front-side and o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13274814741472ba8d69ee6216ec234c
https://doi.org/10.1109/impact.2016.7800011
https://doi.org/10.1109/impact.2016.7800011
Autor:
Chih-Yuan Cheng, Li-Cheng Shen, Shu-Ming Chang, Cheng-Ta Ko, Yu-Jiau Hwang, Yu-Fang Chen, Kuo-Chyuan Chen, Kuo-Ning Chiang
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:377-383
Wafer level chip scale packaging (WLCSP) has some advantages, such as real die size packaging, high electrical performance, and low manufacturing cost. However, because the mechanical reliability of a large die can not be guaranteed due to the coeffi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec05e7a3ce2f257aa93ccba22040e7e7
https://doi.org/10.1109/tadvp.2007.901773
https://doi.org/10.1109/tadvp.2007.901773
Autor:
Kuo-Chyuan Chen, Tao-Chih Chang, Ren-Shin Cheng, Su-Ching Chung, Su-Yu Fun, Chia-Wen Fan, Chau-Jie Zhan, Yu-Lan Lu
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Flip chip package has been reported to be an ideal package solution of high bandwidth devices because of a lower power loss and a short transmission route of signal. However, some failure modes such as solder joint crack, delamination of substrate or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9061218d0519b40d81650376eeede61
https://doi.org/10.1109/impact.2015.7365250
https://doi.org/10.1109/impact.2015.7365250
Autor:
Zhi-Cheng Hsiao, Wei Li, Chao-Kai Hsu, Cheng-Ta Ko, Yu-Hua Chen, Tzu-Ying Kuo, Kuo-Chyuan Chen, Yin-Po Hung
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Flexible electronic system package technology was developed to meet the needs of flexible application. Because of the flexible characteristic, the package can be attached to a flat, curve surface and even a dynamic surface. It is important to provide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::922d0096e05a7076a00c0a9e111df007
https://doi.org/10.1109/impact.2010.5699606
https://doi.org/10.1109/impact.2010.5699606
Autor:
Yin-Po Hung, Kuo-Chyuan Chen, Tzu-Ying Kuo, Yu-Hua Chen, Zhi-Cheng Hsiao, Ying-Ching Shih, Jui-Hsiung Huang, Jing-Yao Chang, Chao-Kai Hsu, Chih-Yuan Cheng, Ching-Kuan Lee, Cheng-Ta Ko
Publikováno v:
2009 59th Electronic Components and Technology Conference.
This paper discloses an ultra-thin and highly flexible package with embedded active chips. In this structure, there are no any supporting and permanent substrates needed. A 3um copper foil with 18um carrier layer was used as temporal substrate. The c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de2fc8500fedceeffd06c2af611ffa1f
https://doi.org/10.1109/ectc.2009.5074201
https://doi.org/10.1109/ectc.2009.5074201
Autor:
Cheng-Ta Ko, Yu-Jiau Hwang, Kuo-Chyuan Chen, Yuan-Chang Lee, Zhi-Cheng Hsiao, Ying-Ching Shih, Yu-Hua Chen, Chih-Yuan Cheng, Huan-Chun Fu
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
Previously, the electronics devices are always integrated into a rigid substrate. Itpsilas stronger, but hardly compatible with Bio-tech or some implanted systems for human being whose packaging point should be more focusing on the flexibility or eve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d587e97b31dd25be18f5c79d3f11eb7d
https://doi.org/10.1109/estc.2008.4684557
https://doi.org/10.1109/estc.2008.4684557
Publikováno v:
56th Electronic Components and Technology Conference 2006.
We demonstrated a technique for self-assembly using a plurality of silicon microchips onto a silicon substrate and performing further self-alignment at a high temperature to form permanently electrical connection by the eutectic solder bumps. Self-as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98cedabee179648d238d5993318707a1
https://doi.org/10.1109/ectc.2006.1645859
https://doi.org/10.1109/ectc.2006.1645859
Autor:
Ren-Shin Cheng, Chau-Jie Zhan, Su-Yu Fun, Su-Ching Chung, Kuo-Chyuan Chen, Yu-Lan Lu, Chia-Wen Fan, Tao-Chih Chang
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2015, p241-244, 4p
Autor:
Tzu-Ying Kuo, Zhi-Cheng Hsiao, Yin-Po Hung, Wei Li, Kuo-Chyuan Chen, Chao-Kai Hsu, Cheng-Ta Ko, Yu-Hua Chen
Publikováno v:
Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International; 2010, p1-4, 4p