Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Kuo-Chung Yee"'
Autor:
Douglas C. H. Yu, Chuei-Tang Wang, Chia-Chia Lin, Chih-Hsin Lu, Gene Wu, Chien-Yuan Huang, Wei-Ting Chen, Terry Ku, Kuo-Chung Yee, Chung-Hao Tsai
Publikováno v:
IEEE Transactions on Electron Devices. 69:7167-7172
Publikováno v:
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :69-93
Publikováno v:
Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :95-124
Autor:
Kuo-Chung Yee, Doug C. H. Yu
Publikováno v:
2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
Data centric era has come and prevails across cloud, networking and edge applications. AI and 5G applications, such as intelligent manufacturing, AR/VR, connected devices and smart cars, are generating an explosion of data. This deluge of data demand
Autor:
Hsi-Ching Wang, C.H. Yu, Doug C. H. Yu, Hsieh Ching-Hua, Chuei-Tang Wang, Welling Chu, Tai-Hao Peng, C. C. Kuo, Wei-Heng Lin, Jeng-Shien Hsieh, Chung-Hao Tsai, Yi-Yang Lei, Kuo-Chung Yee, Liang-Ju Yen, Lawrence Chiang Sheu, Issac Huang, C. S. Liu, Hung Jeng-Nan
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM).
High performance passive devices for millimeter wave (MMW) system, including inductor, ring resonator, power combiner, coupler, balun, transmission line, and antenna, are first realized using integrated fan-out (InFO) wafer level packaging technology
Autor:
Kuo-Chung Yee, Tess J. Moon
Publikováno v:
Journal of Reinforced Plastics and Composites. 22:131-147
In this paper, the compressive strengths of in-situ cured composite rings using a simple mechanical text fixture are presented. Reported results include T300/epoxy as well as E-glass/epoxy hoop-wound composite rings. A J2 deformation theory of plasti
Conference
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