Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Kuo-Chuan Chen"'
Autor:
Kuo-Chuan Chen, 陳國泉
96
This thesis is composed of two parts. Part one contains the study of gas adsorption on carbon-supported Ru catalysts. It is found that CO chemisorption and XRD agree with each other in charactering Ru catalysts. However, H2 chemisorption on R
This thesis is composed of two parts. Part one contains the study of gas adsorption on carbon-supported Ru catalysts. It is found that CO chemisorption and XRD agree with each other in charactering Ru catalysts. However, H2 chemisorption on R
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/31017291144603680255
Autor:
Kuo-Chuan Chen, 陳國銓
97
In recent years, the performance of electronic system has advanced steadily with the progress of semiconductor technology. Overheating has also become more and more serious. In order to solve this problem many forms of heat dissipation have b
In recent years, the performance of electronic system has advanced steadily with the progress of semiconductor technology. Overheating has also become more and more serious. In order to solve this problem many forms of heat dissipation have b
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/00781409633639094376
Autor:
Kuo-Chuan Chen, 陳國泉
83
Article 106 「Responsible attentions and procedures for ship''s sailing」of the ROC Maritime law reads:“ before and when ship'' s sailing the shipper or ship owner shall pay attentions and procedures for the following matters: 1. always k
Article 106 「Responsible attentions and procedures for ship''s sailing」of the ROC Maritime law reads:“ before and when ship'' s sailing the shipper or ship owner shall pay attentions and procedures for the following matters: 1. always k
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/59899102022018546475
Autor:
Lance Horng, Kuo-Chuan Chen
Publikováno v:
Journal of Magnetism and Magnetic Materials. 209:237-239
Magnetic properties of a high-quality Bi-2223 superconducting tape have been studied by various magnetization measurements using SQUID magnetometer for understanding the flux dynamics. The remnant flux relaxation was carried out for a very long time
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a84ed710d85a7f880372197a333c8aa1
https://doi.org/10.1016/s0304-8853(99)00700-3
https://doi.org/10.1016/s0304-8853(99)00700-3
Publikováno v:
Physica C: Superconductivity. 173:227-231
Magnetization hysteresis measurements on a melt-textured YBa 2 Cu 3 O x superconductor have been carried out. Saw-toothed flux jumps occurred more frequently when the relaxation time (the stable-field-time interval during measurement) was reduced, or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3148ca8ec9a57d331bf927399b61076d
https://doi.org/10.1016/0921-4534(91)90373-7
https://doi.org/10.1016/0921-4534(91)90373-7
Autor:
Kuo-Ning Chiang, Kuo-Chuan Chen, Chiao-Yun Chang, Shu-Ming Chang, Yu-Jiau Hwang, Li-Cheng Shen, Hsu-Tien Hu, Yu-Fang Chen, Jeng-Dar Ko, Chin-Yuan Cheng
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Wafer level chip scale packaging (WLCSP) has some advantages, such as real die size packaging, high electrical performance and low manufacturing cost. However, because the mechanical reliability of a large die can not be guaranteed due to the CTE (co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b16d5f2c2137e30ae910cecf994e887
https://doi.org/10.1109/eptc.2004.1396568
https://doi.org/10.1109/eptc.2004.1396568
Autor:
Shu-Ming Chang, Hsu-Tien Hu, Ruoh-Huey Uang, Yu-Fang Chen, Yu-Hua Chen, Dau-Chi Liou, Kuo-Chuan Chen
Publikováno v:
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::839197f6cbb5ba205dc8c7947c74c70f
https://doi.org/10.1109/ectc.2003.1216446
https://doi.org/10.1109/ectc.2003.1216446
Autor:
Li-Cheng Shen, Kuo-Chuan Chen, Shu-Ming Chang, Yu-Fang Chen, Wei-Chung Lo, Yu-Chih Chen, Hsu-Tien Hu, Huan-Chun Fu
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Lots of advanced packaging forms were introduced to meet different application by using the solder balls as the interconnect media between chip and substrate. With the environment protection concerns increasing, lead free solders are playing the more
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d529fe37a96cc3e14d449ef8a280b98c
https://doi.org/10.1109/eptc.2003.1271586
https://doi.org/10.1109/eptc.2003.1271586
Autor:
Jyh-Rong Lin, Yu-Jiau Hwang, Hsu-Tien Hu, Yu-Chih Chen, Ruoh-Huey Uang, Kuo-Chuan Chen, Shu-Ming Chang
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
Recently, flip chip package has obtained more and more attentions due to its benefits of high I/O, low inductance and better thermal dissipation. Therefore flip chip package is getting to be used in some high performance and high speed devices such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e3bd4aa358d807930abc4ee03a6ad7c
https://doi.org/10.1109/eptc.2002.1185680
https://doi.org/10.1109/eptc.2002.1185680
Autor:
Kuo-Chuan Chen, Jyh-Rong Lin, Shu-Ming Chang, Wei-Chung Lo, Yu-Chih Chen, Hsu-Tien Hu, Yu-Jiau Hwang, Li-Cheng Shen
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
In this paper, one of the wafer level chip scale packaging (WL-CSP) patents issued by ERSO/ITRI, the double elastomer wafer level package, is implemented on the test vehicle of Rambus DRAM to demonstrate the applicability and reliability of WL-CSP fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::898700eac18f584f6622a51fe281ea19
https://doi.org/10.1109/eptc.2002.1185671
https://doi.org/10.1109/eptc.2002.1185671