Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Kuntak Lee"'
Publikováno v:
Metals and Materials International. 19:335-339
In this study, the effect of the friction and wear of a polishing pad on the material removal rate of a silicon oxide wafer was investigated during chemical mechanical polishing (CMP) with ceria slurry. Further, the effect of surface properties of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e534e0b8c9236fc5186a52ee88b949a3
https://doi.org/10.1007/s12540-013-2031-0
https://doi.org/10.1007/s12540-013-2031-0
Publikováno v:
Metals & Materials International; Mar2013, Vol. 19 Issue 2, p335-339, 5p