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pro vyhledávání: '"Kunlushie Xie"'
Autor:
Bo Yuan Ruan, Simon Shi, Huei Nuan Huang, Jimmy Chen, Yu Huci Tsai, Hs Zhuang, Joseph Hung, Chung Liang Liu, Ting Kai Huang, Austin Huang, Kunlushie Xie
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
For 2.5D/3D integrated circuit assembly application, thin core package is one of the important indexes. Comparing with traditional substrate, the benefits of thin core substrate are lower z-height, lightweight, low cost and high performance. However,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e21316cc2c78301392a492b105ee2345
https://doi.org/10.1109/eptc47984.2019.9026612
https://doi.org/10.1109/eptc47984.2019.9026612
