Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Kunihiko Nishi"'
Autor:
Kunihiko Nishi
Publikováno v:
Journal of the Surface Finishing Society of Japan. 52:374-378
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e69d29ec4fdfa3af2eed252406b0784
https://doi.org/10.4139/sfj.52.374
https://doi.org/10.4139/sfj.52.374
Autor:
Kunihiko Nishi
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 10:341-343
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00953512093d1e1c462923e5b225d977
https://doi.org/10.5104/jiep.10.341
https://doi.org/10.5104/jiep.10.341
Autor:
Yukiharu Akiyama, Tsuyoshi Kaneda, Kunihiko Nishi, Asao Nishimura, Kunihiro Tsubosaki, Hiroshi Watanabe
Publikováno v:
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 16:540-547
Wire bonding technology is being applied to narrower pad piches and longer spans in LSI packages with the increase in number of input-output pins and shrinkage in chip size. This makes adjoining wires liable to touch during the molding process. To so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7d5cca97046fd63728606a0bd188611
https://doi.org/10.2207/qjjws.16.540
https://doi.org/10.2207/qjjws.16.540
Publikováno v:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits. 12:413-417
半導体BGAパッケージのはんだボール接合部は接続強度, 信頼性上重要な箇所である。はんだ接合部を有する試験片を作成し, せん断試験を行って疲労寿命を評価した。疲労試験後の接合部
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4d74dc4bd3d9b90f4c69e3ba541f7a2
https://doi.org/10.5104/jiep1995.12.413
https://doi.org/10.5104/jiep1995.12.413
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 57:1575-1580
Thermal stress in silicon chips encapsulated in IC plastic packages was discussed using stress-sensing chips which the authors developed utilizing the piezoresistive effect of silicon. Sensor chips were encapsulated in dual-in-line-type packages usin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::495147e36a25b3796587942adfef2c89
https://doi.org/10.1299/kikaia.57.1575
https://doi.org/10.1299/kikaia.57.1575
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 56:1209-1216
Fundamental equations based on the linear-thermoviscoelastic theory were established to obtain the temperature and residual stress by cooling in a 3-layer laminated beam. The transient thermal stress and deformation in the laminated beam made of comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9fe700d215cf10998a708a5ecdcfc2e
https://doi.org/10.1299/kikaia.56.1209
https://doi.org/10.1299/kikaia.56.1209
Publikováno v:
26th Annual Proceedings Reliability Physics Symposium 1988.
Package cracking that occurs in surface-mount devices that have absorbed moisture has been studied by means of a moisture-diffusion analysis of the plastic, deformation and stress analysis of the package, and measurement of some high-temperature prop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::72e76b02f497cd7fc699bb18ab78cb49
https://doi.org/10.1109/relphy.1988.23432
https://doi.org/10.1109/relphy.1988.23432
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 55:1763-1770
Residual stress in IC silicon chips molded using epoxy resin is discussed. Stress-sensing chips were used for the measurement of residual stress which developed during assembly processes for IC plastic packages. It was found that the stress field in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5e1848ed947b56042c61bc1541b8e43
https://doi.org/10.1299/kikaia.55.1763
https://doi.org/10.1299/kikaia.55.1763
Publikováno v:
Bulletin of the Japan Institute of Metals. 28:76-83
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba735ee6de4105f05195e13b3112e89d
https://doi.org/10.2320/materia1962.28.76
https://doi.org/10.2320/materia1962.28.76
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 53:1826-1832
A stress sending Si chip utilizing the piezoresistive effect of Si single crystals has been developed. This chip can measure 3-dimensional stress components, σx, σy, σz and shear stress τxy in the chip surface. The stress sensitivity is 0.1 MPa i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c979ddbf3c2be182934984694322736
https://doi.org/10.1299/kikaia.53.1826
https://doi.org/10.1299/kikaia.53.1826