Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Kun Young Chung"'
Autor:
Soumya Mittal, Szczepan Urban, Kun Young Chung, Jakub Janicki, Wu-Tung Cheng, Martin Parley, Manish Sharma, Shaun Nicholson
Publikováno v:
2022 IEEE International Test Conference (ITC).
Autor:
Manish Sharma, Gaurav Veda, Soumya Mittal, Martin E. Parley, Kun Young Chung, Shaun Nicholson, Wu-Tung Cheng, Matt Knowles
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents a new method for improving the quality and effectiveness of scan-based tests. The method, called statistical diagnosis, leverages defect likelihoods learned from analyzing populations of failing die instead of analyzing each die i
Autor:
Kun Young Chung, Stefano Di Carlo
Publikováno v:
VTS
Publikováno v:
DAC
Scan chain timing is increasingly critical to test time and product cost. However, hold buffer insertions (e.g., due to large clock skew) limit scan timing improvement. Dynamic voltage drop (DVD) during scan shift further degrades scan shift timing,
Publikováno v:
ASP-DAC
Embedded memories are critical to success or failure of complex system-on-chip (SoC) products. They can be significant yield detractors as a consequence of occupying substantial die area, creating placement and routing blockages, and having stringent
Publikováno v:
Journal of Business Ethics. 79:121-132
This paper reports the results of a survey of 842 undergraduate business students in four nations – the United States of America (the USA), the Peoples’ Republic of China (the PRC), Japan, and the Republic of Korea (the ROK). This survey asked st
Publikováno v:
Journal of Business Ethics. 43:89-102
Business relations rely on shared perceptions of what is acceptable/expected norms of behavior. Immense expansion in transnational business made rudimentary consensus on acceptable business practices across cultural boundaries particularly important.
Autor:
Janusz Rajski, Yu Huang, Jihye Kim, Dongkwan Han, Kun Young Chung, Mark Kassab, Jay Jahangiri, Wu-Tung Cheng
Publikováno v:
NATW
This paper proposes an innovative test compression technology for system-on-chip (SoC) designs to share scan input channels across multiple cores which use EDT [1] compression. A new DFT compression architecture is proposed to separate control and da
Autor:
Kun Young, Chung, Yong Ki, Kim
Publikováno v:
総合研究所紀要 = ST. ANDREW'S UNIVERSITY, BULLETIN OF RESEARCH INSTITUTE. 22(3):29-45
Publikováno v:
VTS
Test compression has become a requirement for many designs to meet the required test quality levels in reasonable test times and with acceptable test cost. This session will cover some of the tradeoffs and options available from the broad spectrum of