Výsledky vyhledávání - "Kun Tack Lee"

Electrostatic Discharge Control and Visualization in Spray Nozzle

Autor: Kim Tae-Hong, Kun Tack Lee, Ji Hoon Cha, Yong Sun Koh, Young-Hoo Kim

Publikováno v: Solid State Phenomena. 282:77-80

The general method to remove contaminated particles in the non-pattern cleaning such as pre-photo cleaning, post-deposition cleaning, and post-CMP cleaning is to physically remove particles using spray nozzle. However, high-speed fluids for increasin

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::48ebd70ab9231083db435acbc4c14c65
https://doi.org/10.4028/www.scientific.net/ssp.282.77

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Formation of Dendrite-Like Defect during PR-Mask Silicon Oxide Wet Etching Process and Its Removal Method

Autor: Bo Un Yoon, Kun-tack Lee, Si-Young Choi, Myung-Geun Song

Publikováno v: ECS Solid State Letters. 2:P97-P100

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f3f3c971dad078cbc6f8a8eeb3b47774
https://doi.org/10.1149/2.010310ssl

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Effect of pad surface roughness on material removal rate in chemical mechanical polishing using ultrafine colloidal ceria slurry

Autor: Kun-tack Lee, Hong Jin Kim, Youngsun Ko, Han Sol, Byoung Ho Kwon, Myung Ki Hong

Publikováno v: Electronic Materials Letters. 9:155-159

In this paper, effect of ultrafine ceria (UFC) particle of which size is as small as 20 nm on CMP performance was investigated. Compared to conventionally used 100 nm abrasive particle which is made by calcination process, almost 80% scratch reductio

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::29eb3a9b1f85e1d1ef6895e4994baa17
https://doi.org/10.1007/s13391-012-2144-5

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A study of swing-curve physics in diffraction-based overlay

Autor: Marc Noot, Elliott McNamara, Chan Hwang, Kaustuve Bhattacharyya, Seung Yoon Lee, Frank van de Mast, Nang-Lyeom Oh, Se-Ra Jeon, Joost van Heijst, Noh-Kyoung Park, Arie Jeffrey Den Boef, Kun-tack Lee, Kevin An, SeungHwa Oh, Greet Storms

Publikováno v: SPIE Proceedings.

With the increase of process complexity in advanced nodes, the requirements of process robustness in overlay metrology continues to tighten. Especially with the introduction of newer materials in the film-stack along with typical stack variations (th

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::efd0e3530c1f43ec58e9259ce2f607b1
https://doi.org/10.1117/12.2222040

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Metrology target design simulations for accurate and robust scatterometry overlay measurements

Autor: Sang Hyun Han, Michael E. Adel, Seung Yoon Lee, Mohamed El Kodadi, Guy Ben-Dov, Dongsub Choi, Soonho Oh, Chan Hwang, Kun-tack Lee, Inna Tarshish-Shapir, Eitan Herzel, David Gready, Jeongjin Lee, Mark Ghinovker

Publikováno v: SPIE Proceedings.

Overlay metrology target design is an essential step prior to performing overlay measurements. This step is done through the optimization of target parameters for a given process stack. A simulation tool is therefore used to improve measurement perfo

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c6f6304d4fbb7509845075242e531c90
https://doi.org/10.1117/12.2219108

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Comparisons of Various Physical Cleaning

Autor: Sang Won Bae, Yong Sun Koh, Dae Hyuk Kang, Kun Tack Lee, Hyo San Lee

Publikováno v: Solid State Phenomena. 187:131-134

Physical cleaning uses the physical force for particle removing process and the physical force can be represented by PRE(%) and pattern damage. Using the damage proving pattern, which was composed with conductive material for electrical detection, th

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::cf62c0b8048ea6721f005d11a0921227
https://doi.org/10.4028/www.scientific.net/ssp.187.131

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Contact Behavior and Chemical Mechanical Polishing (CMP) Performance of Hole-Type Polishing Pad

Autor: Kun-tack Lee, Myung Ki Hong, Yong-Sun Ko, Hong Jin Kim, Jae Kwang Choi

Publikováno v: ECS Journal of Solid State Science and Technology. 1:P204-P209

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::945b863236aa8a560936c7464f7d2921
https://doi.org/10.1149/2.021204jss

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Prevention of Condensation Defects on Contact Patterns by Improving Rinse Process

Autor: Jung-min Oh, Jeong Nam Han, Chang-ki Hong, Kun Tack Lee, Joo Tae Moon, Woo-Sung Han, Jin-Goo Park

Publikováno v: Solid State Phenomena. :151-154

The present work reports a method to prevent the condensation defects on contact hole patterns by improving the rinsing process after a dry etching. In general, residual gases on the surface after the dry etching can be easily removed by using a DI w

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::67d1ea282d16e50a7ddf2a54c74f7ce9
https://doi.org/10.4028/www.scientific.net/ssp.145-146.151

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