Comparison of advanced package warpage measurement metrologies.

Autor: Kultcrman, Ron W., Loh, Wei Keat, Fu, Haley, Tsuriya, Masahiro

Publikováno v: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-8, 8p