Thermal Contact Conductances of Metallic Contacts at Low Loads

Autor: Jeevanashankara,, Madhusudana, CV, Kulkarni, MB

Publikováno v: IndraStra Global.

Experimental investigations on thermal contact conductances of metallic contacts have been reported here. The studies are restricted to relatively low contact pressure: hardness ratios $(< 0.7 \times 10^{-3})$ where very little data exist. These resu

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=issn23813652::579d1b72449b02a415e7dcd3843db85b
http://eprints.iisc.ac.in/12823/1/300.pdf

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A Machine Learning Assisted Non-Enzymatic Electrochemical Biosensor to Detect Urea Based on Multi-Walled Carbon Nanotube Functionalized with Copper Oxide Micro-Flowers.

Autor: Zalke JB; Department of Electronics Engineering, Ramdeobaba University, Nagpur 440013, MH, India., Bhaiyya ML; Department of Electronics Engineering, Ramdeobaba University, Nagpur 440013, MH, India., Jain PA; Department of Biomedical Engineering, Shri Ramdeobaba College of Engineering and Management, Nagpur 440013, MH, India., Sakharkar DN; Department of Biomedical Engineering, Shri Ramdeobaba College of Engineering and Management, Nagpur 440013, MH, India., Kalambe J; Department of Electronics Engineering, Ramdeobaba University, Nagpur 440013, MH, India., Narkhede NP; Department of Electronics Engineering, Ramdeobaba University, Nagpur 440013, MH, India., Thakre MB; Department of Chemistry, D.R.B. Sindhu Mahavidhyalaya, Nagpur 440017, MH, India., Rotake DR; Department of Electrical Engineering, Indian Institute of Technology, Hyderabad 502284, TG, India., Kulkarni MB; Department of Medical Physics, University of Wisconsin-Madison, Madison, WI 53705, USA.; Department of Electronics and Communication Engineering, Manipal Institute of Technology, Manipal Academy of Higher Education (MAHE), Manipal 576104, KA, India., Singh SG; Department of Electrical Engineering, Indian Institute of Technology, Hyderabad 502284, TG, India.

Publikováno v: Biosensors [Biosensors (Basel)] 2024 Oct 15; Vol. 14 (10). Date of Electronic Publication: 2024 Oct 15.