Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Kuifeng Zhu"'
Autor:
Xiaoyan Chen, Jianyong Chen, Xiaoguang Han, Chundong Zhao, Dongyang Zhang, Kuifeng Zhu, Yanjie Su
Publikováno v:
IEEE Access, Vol 8, Pp 24006-24018 (2020)
Silicon wafer is the raw material of semiconductor chip. It is important and challenging to research a fast and accurate method of identifying and classifying wafer structural defects. To this end, we present a novel detection method in terms of the
Externí odkaz:
https://doaj.org/article/ffab78bee6bb47ae9b7d9ee117b7289c
Publikováno v:
SSRN Electronic Journal.
Publikováno v:
Journal of Alloys and Compounds. 928:167126
Publikováno v:
Proceedings of International Conference on Artificial Life and Robotics. 25:795-799
Publikováno v:
2020 IEEE 4th Information Technology, Networking, Electronic and Automation Control Conference (ITNEC).
Grain surface defects have become an important factor affecting chip quality. How to correctly detect grain surface defects is a complicated and challenging task. Defect detection technology has become a key technology in the chip industry. K-means c
Publikováno v:
Journal of Physics: Conference Series. 1449:012111
With the development of semiconductor chips manufacturing, the quality of chips are required to a higher level. At present, as a key element of chip produce process, wafer surface defect detection is a hard challenge for operators, as manual detectio
Publikováno v:
Journal of Physics: Conference Series; 2020, Vol. 1449 Issue 1, p1-1, 1p
Publikováno v:
Journal of Materials Chemistry C; 11/7/2021, Vol. 9 Issue 41, p14501-14513, 13p
Autor:
Li, Menghan, Xu, Jianping, Zhu, Kuifeng, Shi, Shaobo, Zhang, Qiuyang, Bu, Yichen, Chen, Jing, Xu, Jianghua, Zheng, Qin, Su, Yanjie, Zhang, Xiaosong, Li, Lan
Publikováno v:
Journal of Materials Chemistry C; 11/7/2021, Vol. 9 Issue 41, p14613-14622, 10p