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pro vyhledávání: '"Kuang-Chun Li"'
Publikováno v:
Sensors and Materials. 32:2057
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdb2a7cf4dfd028d3e366445899f3a9a
https://doi.org/10.18494/sam.2020.2786
https://doi.org/10.18494/sam.2020.2786
Autor:
Kuang-Chun Lin, 林劻錞
107
With the advancement of the semi-conductor manufacturing process, the feature size of transistors shrinks aggressively. The chip size could thus become smaller. However, this also makes the chip more susceptible to manufacturing defects/nois
With the advancement of the semi-conductor manufacturing process, the feature size of transistors shrinks aggressively. The chip size could thus become smaller. However, this also makes the chip more susceptible to manufacturing defects/nois
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/ks9r5b
