Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Kuan-I Cheng"'
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Nowadays, copper pillar bump is usually used in power IC and driver IC which in the environment of high current density and high temperature. When the energy is higher than active energy, electromigration happened and change the structure of package.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef9f1e99284455f54b414bd42718bcd7
https://doi.org/10.1109/eptc.2017.8277485
https://doi.org/10.1109/eptc.2017.8277485
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Technology of electrical characteristics extraction about FR4 by using near-field measurement system is proposed in this research. It is easy to observe the electromagnetic field at each point on device under test (DUT) by near-field measurement syst
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79ad5671a262745dd8c12029f6446c1f
https://doi.org/10.1109/eptc.2017.8277511
https://doi.org/10.1109/eptc.2017.8277511
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Nowadays, copper bump is often used in driver IC which usually used in high current density environment. High current density leads to electromigration. Therefore, the main objective of this paper is reliability analysis, including observing the chan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fce94986ee2728f2c3c99be999f24786
https://doi.org/10.23919/icep.2017.7939441
https://doi.org/10.23919/icep.2017.7939441
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
In traditional Quad Flat Package(QFP), solder joint quality and electrical analysis always been a critical issue. In original PCB land pad design, thermal opening is the same size of QFP thermal pad. In this design, solder joint yield is about 87.5%.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::369149fb90eebf4a3a8b45520364ba05
https://doi.org/10.23919/icep.2017.7939446
https://doi.org/10.23919/icep.2017.7939446
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
The socket is regarded as a testing interface. It can measure the performance of package and fix the signal path from ATE to DUT (Device under Test). With testing frequency getting higher and higher, it will cause SI (Signal Integrity) problem when t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a4f6289fcfc41d1bb90026cf4cc9675
https://doi.org/10.1109/eptc.2016.7861571
https://doi.org/10.1109/eptc.2016.7861571
Publikováno v:
2015 Asia-Pacific Microwave Conference (APMC).
In this paper, the main purpose is reliability analysis. To find what kinds of environment will impact the inner structure of sample. Two of the objective is emerged from this study. First, electro-migration in sample under high current density has b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c193c64e1a5df4188ee86d703613e17
https://doi.org/10.1109/apmc.2015.7411701
https://doi.org/10.1109/apmc.2015.7411701