Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Kuan Chien-Wei"'
Autor:
Chieh-Hsun Hsiao, Ting-Hsun Kuo, Che-Hao Meng, Hsin-Hung Chen, Chen-Yen Ho, Peng Chia-Sheng, Hao-Ping Hong, Lin Shih-Mei, Sung Da-Wei, Sheng-Hong Yan, Kuan Chien-Wei
Publikováno v:
ISSCC
Modulation schemes employed in long-term-evolution advanced (LTE-A) services for higher data-rate with high peak-to-average power ratios (PAPR) are becoming more complicated, which degrades the efficiency of RF power amplifiers (PA). Envelope-trackin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff774ccae1820ee8566b8fec4b2648e5
https://doi.org/10.1109/isscc.2018.8310369
https://doi.org/10.1109/isscc.2018.8310369
Autor:
Jhy-Rong Chen, Yuan Sun, Jing-Hong Conan Zhan, Hsuan-Yu Liu, Chih-Fan Liao, Min Chen, Chihun Lee, Kuo-Hao Chen, Chia-Jui Hsu, Wei-Kai Hong, Sheng-Jau Wong, Yu-Li Hsueh, Chunwei Chang, Hong-Kai Hsu, Osama Shana'a, Hong-Lin Chu, Chao-Hsin Lu, Eng Chuan Low, Deyong Hu, Guang-Kaai Dehng, George Chien, Kuan Chien-Wei, Yi-Hsien Cho, Weimin Shu, Chih-Hsien Shen, Yuan-Hung Chung, Jui-Lin Hsu, Tsung-Ming Chen, Li-Chun Ko, Jie-Wei Lai, Xudong Jiang
Publikováno v:
ISSCC
In recent years, the increasing popularity of mobile devices, such as smart-phones and tablets, is driving the demand for integrating multiple radios on a single SoC to reduce cost, form factor and external BOM [1]. These devices require ubiquitous w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::804e05f763d4d6a7c48defc4f98e2bef
https://doi.org/10.1109/isscc.2012.6176964
https://doi.org/10.1109/isscc.2012.6176964
Autor:
Hung-Chih Lin, Kuan Chien-Wei
Publikováno v:
ISSCC
For minimizing the power consumption in portable devices, efficient DC-DC converters with a wide range of regulated voltages and currents are needed. Considering the required footprint area, cost, and chip count, integration of single-inductor-multip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0cf94fae565e1cf44d120618a5467f0
https://doi.org/10.1109/isscc.2012.6177013
https://doi.org/10.1109/isscc.2012.6177013
Autor:
Kuan, Chien-Wei, Lin, Hung-Chih
Publikováno v:
2012 IEEE International Solid-State Circuits Conference; 1/ 1/2012, p274-276, 3p
Autor:
Chung, Yuan-Hung, Chen, Min, Hong, Wei-Kai, Lai, Jie-Wei, Wong, Sheng-Jau, Kuan, Chien-Wei, Chu, Hong-Lin, Lee, Chihun, Liao, Chih-Fan, Liu, Hsuan-Yu, Hsu, Hong-Kai, Ko, Li-Chun, Chen, Kuo-Hao, Lu, Chao-Hsin, Chen, Tsung-Ming, Hsueh, YuLi, Chang, Chunwei, Cho, Yi-Hsien, Shen, Chih-Hsien, Sun, Yuan
Publikováno v:
2012 IEEE International Solid-State Circuits Conference; 1/ 1/2012, p172-174, 3p