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pro vyhledávání: '"Kuai, Wenlin"'
Autor:
Kuai, Wenlin
Le travail entre dans le cadre de la nouvelle tendance à la recherche d’une électronique mécaniquement flexible basée sur des transistors en couche mince constitués uniquement de matériaux organiques (OTFT). OTFT de type n et de type p ont é
Externí odkaz:
http://www.theses.fr/2017REN1S013/document
Publikováno v:
Conference on Thin Film Transistors ITC 2015
Conference on Thin Film Transistors ITC 2015, Feb 2015, Rennes, France
Conference on Thin Film Transistors ITC 2015, Feb 2015, Rennes, France
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::07b00e58ac22b5ccc989498b626c60fe
https://hal.science/hal-01121609
https://hal.science/hal-01121609
Autor:
Sjeung Jae Moon, Malo Robin, Kuai Wenlin, Byung Seong Bae, Emmanuel Jacques, Maxime Harnois, Molard Yann, Tayeb Mohammed-Brahim
Publikováno v:
Flexible and Printed Electronics
Flexible and Printed Electronics, IOP Science, 2017, 2 (3), pp.035008. ⟨10.1088/2058-8585/aa8760⟩
Flexible and Printed Electronics, 2017, 2 (3), pp.035008. ⟨10.1088/2058-8585/aa8760⟩
Flexible and Printed Electronics, IOP Science, 2017, 2 (3), pp.035008. ⟨10.1088/2058-8585/aa8760⟩
Flexible and Printed Electronics, 2017, 2 (3), pp.035008. ⟨10.1088/2058-8585/aa8760⟩
This study reports on the impact of electrodes (source and drain) and the insulator cross-sectional profile on the electrical behavior of printed organic field effect transistors (OFETs). Varying processing techniques, from classical lithography to i
Akademický článek
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Autor:
Kuai, Wenlin, Shang, Jintang, Wei, Wenlong, Qin, Shunjin, Wang, Tingting, Chen, Jie, Zhang, Li, Lai, CM
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging; 1/ 1/2012, p993-996, 4p
Autor:
Qin, Shunjin, Shang, Jintang, Zhang, Li, Wang, Tingting, Lv, Siyuan, Lai, Chiming, Kuai, Wenlin, Wei, Wenlong
Publikováno v:
2012 IEEE 62nd Electronic Components & Technology Conference; 1/ 1/2012, p213-217, 5p
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging; 1/ 1/2012, p1639-1641, 3p