Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Krzysztof Stojek"'
Publikováno v:
Soldering & Surface Mount Technology. 32:241-246
PurposeThis paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metal
Autor:
Kamil Gorzka, Krzysztof Stojek, Tomasz Falat, Milena Kiliszkiewicz, Danylo Lizanets, Jan Felba
Publikováno v:
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
Research goal was to detect defects and imperfections of sintered silver layer at thermal joints. Such defects may influence the contact area which lower mechanical strength of the joint with the usual consequence of reducing the heat flow between jo
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
the development of heat transfer efficiency measurement method through thermal joints made by low temperature and low pressure silver sintering is presented. The research included using reflection of infrared radiation, designing new sample geometry
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The materials and technology parameters impact on mechanical properties for non-metalized silver-based joints made by low-temperature and low-pressure sintered Si surface with using silver nanoparticles is presented. The research approach based on su
Autor:
Andrzej Moscicki, Tomasz Falat, Jan Felba, W. Macherzyński, Przemyslaw Matkowski, Krzysztof Stojek
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
Downsizing and increase of working speed of the electronic circuits bring out generating of large amount of heat during operating. The thermal interface materials (TIMs) are one of the best choice to increase the efficiency of heat transfer from the
Autor:
Andrzej Mościcki, Tomasz Falat, Przemyslaw Matkowski, Krzysztof Stojek, Jan Felba, Bartosz Platek
Publikováno v:
Volume 1: Thermal Management.
Within the paper the efficiency of heat transfer through the thermal interface made of three different sintered nanosilver based materials was considered. The efficiency of heat conduction was analyzed by using the IR camera to monitor the changes of
Autor:
Jan Felba, Andrzej Moscicki, Krzysztof Stojek, Tomasz Falat, Przemyslaw Matkowski, Bartosz Platek
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE).
The miniaturization trend of electronic devices and simultaneous increase of packaging density and clock frequency can generate the large amount of heat that appears during operation of such devices. The thermal interface materials (TIMs) are current
Autor:
Andrzej Moscicki, Tomasz Falat, Przemyslaw Matkowski, Krzysztof Stojek, Bartosz Platek, Jan Felba
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
In this paper the influence of photonic sintering process parameters on the resistance of ink-jet printed structures were examined. The sintering process was performed by delivering to samples an energy in the form of light pulses (1200 J per pulse).