Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Krystian Jankowski"'
Autor:
Artur Wymysłowski, Krystian Jankowski
Publikováno v:
Eksploatacja i Niezawodność – Maintenance and Reliability. 22:297-305
The aim of the research was the problem of damage accumulation for solder alloys used in microelectronics packaging due to creep and fatigue as a result of a combined profile of loading conditions. The selected failure modes affect the lifetime of co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::579647bd86b539422cd03d16b81ada8c
https://doi.org/10.17531/ein.2020.2.12
https://doi.org/10.17531/ein.2020.2.12
Autor:
Artur Wymysłowski, Krystian Jankowski
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The aim of the study is to carrying out a series of experimental reliability tests for lead solder alloy Sn 63 Pb 37 regarding to the so-called model of damage accumulation. In spite of Sn 63 Pb 37 is prohibited in mostly cases by RoHS directive it i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8395517f10d59887d28ddda17e16806
https://doi.org/10.1109/eurosime.2017.7926217
https://doi.org/10.1109/eurosime.2017.7926217
Autor:
Krystian Jankowski, Artur Wymysłowski
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Observed from many years a rapid growth of electronic devices production, induced by introducing new functionalities for customers and moving towards environmentally friendly packaging caused that life prediction of solder joints is more prominent is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::944080a8376d5ee5bdd082578f2317d8
https://doi.org/10.1109/eurosime.2014.6813780
https://doi.org/10.1109/eurosime.2014.6813780
Publikováno v:
Soldering and Surface Mount Technology
Soldering and Surface Mount Technology, 2014, 26 (1), pp.22-26. ⟨10.1108/SSMT-10-2013-0029⟩
Soldering and Surface Mount Technology, Emerald, 2014, 26 (1), pp.22-26. ⟨10.1108/SSMT-10-2013-0029⟩
Soldering and Surface Mount Technology, 2014, 26 (1), pp.22-26. ⟨10.1108/SSMT-10-2013-0029⟩
Soldering and Surface Mount Technology, Emerald, 2014, 26 (1), pp.22-26. ⟨10.1108/SSMT-10-2013-0029⟩
Purpose – The aim of this work is the use of specially designed, authoring device to evaluate the strength of solder alloys commonly used in all kinds of electronic and electrical devices that are used in various fields of economic and industrial d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30d4761dff27ae98405a90a9131af86c
https://hal.science/hal-03577666
https://hal.science/hal-03577666
Publikováno v:
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Avionics is very demanding and specific field of research according to sensor and system design. In systems designed for such applications not only reliability in very low temperatures is key aspect, but also system geometry, energy usage and its wei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c32df4117516c83f3eba64cee7cba261
https://doi.org/10.1109/eurosime.2013.6529937
https://doi.org/10.1109/eurosime.2013.6529937
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2013, 53 (5), pp.761-766. ⟨10.1016/j.microrel.2013.01.008⟩
Microelectronics Reliability, 2013, 53 (5), pp.761-766. ⟨10.1016/j.microrel.2013.01.008⟩
Microelectronics Reliability, Elsevier, 2013, 53 (5), pp.761-766. ⟨10.1016/j.microrel.2013.01.008⟩
Microelectronics Reliability, 2013, 53 (5), pp.761-766. ⟨10.1016/j.microrel.2013.01.008⟩
International audience; Solder joints in microelectronic are used for electrical signals transmission, heat conduction and structural support. One of the key problems referring to solders in microelectronics is reliability due to typical failure mode
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::186671ac13fdfd381d9276a4e733263b
https://hal.archives-ouvertes.fr/hal-00816697
https://hal.archives-ouvertes.fr/hal-00816697
Publikováno v:
2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2012, Cascais, France. pp.1/5-5/5, ⟨10.1109/ESimE.2012.6191743⟩
2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2012, Cascais, France. pp.1/5-5/5, ⟨10.1109/ESimE.2012.6191743⟩
Reliability of solder joints plays a major role in the electronic packaging. Indeed, the solder joints serve not only for the transmitting of electrical signals, but also for the heat transportation and as a structural support which is one of the mos
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::02711ec6d06f68d011d6b9ebb7c2457b
https://doi.org/10.1109/esime.2012.6191743
https://doi.org/10.1109/esime.2012.6191743