Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Kristina Sorokina"'
Publikováno v:
Materials, Vol 17, Iss 11, p 2693 (2024)
This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs
Externí odkaz:
https://doaj.org/article/e891d8a188904db897099bf6aa64ff74
Autor:
Karel Dusek, Petr Vesely, Denis Fros, Martin Kozak, Kristina Sorokina, Zbynek Plachy, David Busek, Jaroslav Dusek, Iva Kralova, Marketa Klimtova, Martin Placek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ffbab2085faeb18f751299731282482
https://doi.org/10.1109/isse54558.2022.9812772
https://doi.org/10.1109/isse54558.2022.9812772
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de12dff12a5f7bfb254179390648a729
https://doi.org/10.1109/isse54558.2022.9812708
https://doi.org/10.1109/isse54558.2022.9812708
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
The article deals with thermal cycling influence on the electrical and mechanical properties of the soldered joint on various gold-plated surfaces. The purpose was to determine the effect of thermal aging on the properties of the soldered joint of Ga
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7504bbb5d39163ebc01fae2273b9bc4d
https://doi.org/10.1109/isse51996.2021.9467593
https://doi.org/10.1109/isse51996.2021.9467593
Autor:
Pavel Durst, Jaroslav Dušek, Karel Dusek, Denis Fros, David Busek, Martin Kozak, Petr Vesely, Kristina Sorokina
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
Electrochemical migration is one of the issues that appears due to specific conditions when the electrolytic solution is present between two neighbouring conductors with different electrical potentials. This article deals with a student’s workplace
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f49a993cae099d242743f6182d3188d5
https://doi.org/10.1109/isse51996.2021.9467605
https://doi.org/10.1109/isse51996.2021.9467605
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
In this work, two surface fimishes- Electroless Nickel Immersion Gold (ENIG) and Galvanic Gold were compared. Solder joints were tested with respect to used materials (ENIG and Galvanic Goldfimishes, lead-free solders SAC305 M8, SAC305 NC257-2), used
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7199f2c0aad6cfccd70be676dc90e96a
https://doi.org/10.1109/isse49702.2020.9121062
https://doi.org/10.1109/isse49702.2020.9121062