Soft x-ray: novel metrology for 3D profilometry and device pitch overlay

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Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films.

Autor: Lin, Kevin L., Bielefeld, Jeffrey, Chawla, Jasmeet S., Carver, Colin T., Chebiam, Ramanan, Clarke, James S., Faber, Jacob, Harmes, Michael, Indukuri, Tejaswi, Jezewski, Christopher, Kasim, Rahim, Kobrinsky, Mauro, Kabir, Nafees A., Krist, Brian, Lakamraju, Narendra, Lang, Hazel, Mays, Ebony, Myers, Alan M., Plombon, John J., Singh, Kanwal Jit

Publikováno v: 2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p139-142, 4p

Demonstration of a sidewall capacitor to evaluate dielectrics and metal barrier thin films.

Autor: Lin, Kevin L., Carver, Colin T., Chebiam, Ramanan, Clarke, James, Faber, Jacob, Harmes, Michael, Indukuri, Tejaswi, Jezewski, Christopher, Kobrinsky, Mauro, Krist, Brian, Lakamraju, Narendra, Lang, Hazel, Myers, Alan M., Plombon, John J., Singh, Kanwal Jit, Yoo, Hui Jae

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