Resistance and electromigration performance of 6 nm wires.

Autor: Chawla, J. S., Sung, S. H., Bojarski, S. A., Carver, C. T., Chandhok, M., Chebiam, R. V., Clarke, J. S., Harmes, M., Jezewski, C. J., Kobrinski, M. J., Krist, B. J., Mayeh, M., Turkot, R., Yoo, H. J.

Publikováno v: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC); 2016, p63-65, 3p