Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Krishnayya Cheemalapati"'
Publikováno v:
Microelectronic Applications of Chemical Mechanical Planarization
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f890202a9b21f9fb306b783f8740d528
https://doi.org/10.1002/9780470180907.ch7
https://doi.org/10.1002/9780470180907.ch7
Autor:
Lily Yao, Guomin Bian, Yong Lin, Yuzhuo Li, Krishnayya Cheemalapati, Kwok Tang, Vivek Duvvuru, A. Chowdhury
Publikováno v:
MRS Proceedings. 816
It is generally accepted that there is a minimum hardness requirement for abrasive particles to be used in CMP (Chemical Mechanical Polishing) slurries. For copper CMP, the common abrasives are various types of alumina and silica. It has also long be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f300b3e83915995e88580451b69ecd63
https://doi.org/10.1557/proc-816-k1.7
https://doi.org/10.1557/proc-816-k1.7
