Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Krishnan, Sundaresan"'
Throughput improvement of the Wireless LANs has been a constant area of research. Most of the work in this area, focuses on designing throughput optimal schemes for fully connected networks (no hidden nodes). But, we demonstrate that the proposed sch
Externí odkaz:
http://arxiv.org/abs/1006.2048
Autor:
Krishnan, Sundaresan1 sundaresan.km@gmail.com, Chaporkar, Prasanna2 chaporkar@ee.iitb.ac.in
Publikováno v:
Journal of High Speed Networks. 2016, Vol. 22 Issue 2, p125-151. 27p.
Akademický článek
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Publikováno v:
DAC
Higher-than-normal wire temperatures and temperature gradients between the sending and receiving ends of a wire that are caused due to Joule heating and substrate hotspots affect the propagation delay of a wire significantly. In this paper, we develo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c46af8f65ebe55c63f8427925c9910fa
https://doi.org/10.1145/1278480.1278612
https://doi.org/10.1145/1278480.1278612
Publikováno v:
ICCD
The influence of interconnects on processor performance and cost is becoming increasingly pronounced with technology scaling. In this paper, we present a fast compression scheme that exploits the spatial and temporal locality of addresses to dynamica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8f81842a6ec5b388cea467736536846
https://doi.org/10.1109/iccd.2006.4380788
https://doi.org/10.1109/iccd.2006.4380788
Publikováno v:
ACM Great Lakes Symposium on VLSI
Interconnect area and energy dissipation are critical factors in any system designed today. In this work, we present techniques to help reduce area/cost and energy dissipation of address buses with significant temporal redundancy. We describe two enc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64795eff5cbd2bc019188275a2f6d462
https://doi.org/10.1145/1127908.1127936
https://doi.org/10.1145/1127908.1127936
Autor:
N.R. Manapatra, Krishnan Sundaresan
Publikováno v:
DATE
In this paper, we present a technique that exploits the statistical behavior of data values transmitted on global signal buses to determine an energy-efficient ordering of bits that minimizes the inter-wire coupling energy and also reduces total bus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::619e43a3f3d9b6247e0abe8670f99b87
https://doi.org/10.1109/date.2006.243997
https://doi.org/10.1109/date.2006.243997
Publikováno v:
VLSI Design
Accurate estimation of energy dissipation and thermal effects in buses is essential to correctly predicting reliability and performance characteristics and packaging requirements of ICs. As fabrication technologies scale down and low-K inter-metal an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa2d39fb298b34f1cfa59a8b8213d0a5
https://doi.org/10.1109/icvd.2005.45
https://doi.org/10.1109/icvd.2005.45
Publikováno v:
HPCA
With technology scaling, power dissipation and localized heating in global and semi-global bus wires are becoming increasingly important, and this necessitates the development of accurate models to explore these effects during design stage, with simu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc406f7879967e559c20945c62ebf511
https://doi.org/10.1109/hpca.2005.5
https://doi.org/10.1109/hpca.2005.5
Publikováno v:
VLSI Design
To realize energy-efficient buses in current nanometer-scale technologies, techniques like compression or encoding that exploit information redundancy have been explored. However, available compression techniques for buses do not always ensure energy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1994c820ba9ee7304edae40f83f0588a
https://doi.org/10.1109/icvd.2005.91
https://doi.org/10.1109/icvd.2005.91