Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Krishna Seshan"'
Autor:
Krishna Seshan
A brief introduction to reliability issues that could limit scaling is presented. Traditional reliability testing is reviewed, together with the standard methods for analyzing the data. Arguments are presented to justify that a modern view of reliabi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bf2ec0f35b3d18ef14844c10a8492c7
https://doi.org/10.1016/b978-0-12-812311-9.00003-7
https://doi.org/10.1016/b978-0-12-812311-9.00003-7
Autor:
Krishna Seshan
Limits or hurdles to scaling past 10 nm are considered. Limits are categorized into different groups: practical and engineering limits such as the cost of fabricators is one; the other is the need for a new lithographic process, such as extreme UV, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18b332dee27a0badebea92a4756659be
https://doi.org/10.1016/b978-0-12-812311-9.00002-5
https://doi.org/10.1016/b978-0-12-812311-9.00002-5
Autor:
Takashi Ando, Michael Belyansky, Elham R. Borujeny, Ken Cadien, Kenneth C. Cadien, Jin Cai, Loren A. Chow, Keith D. Coulson, Robert H. Dennard, Jeff Gambino, Dhruv Gelda, S.B. Herner, Arvind Kumar, Angus Macleod, Mengmeng Miao, Triratna Muneshwar, Lucy Nolan, Rajan K. Pandey, Manjunath C. Rajagopal, Dominic Schepis, Krishna Seshan, Shahab Siddiqui, Andrew H. Simon, Sanjiv Sinha, Krishna V. Valavala
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4a49246546cd6b7c175567499fdd1b4
https://doi.org/10.1016/b978-0-12-812311-9.00022-0
https://doi.org/10.1016/b978-0-12-812311-9.00022-0
Autor:
Krishna Seshan, Dominic Schepis
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, p
Autor:
Krishna Seshan
The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic s
Autor:
Krishna Seshan
Increased heat generation is one of the main consequences of scaling of random logic designs. Memory scaling does not increase dramatically. Heat generation trends and features of the packages designed to cool the chips are discussed. The formulation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68d81d1c4483ec069394ba3e2065c828
https://doi.org/10.1016/b978-1-4377-7873-1.00003-6
https://doi.org/10.1016/b978-1-4377-7873-1.00003-6
Autor:
Michael Belyansky, Kenneth C. Cadien, Loren A. Chow, Jin Cai, Robert H. Dennard, Jeffrey Gambino, S.B. Herner, Mohamed M. Hilali, Arvind Kumar, Angus Macleod, Lucy Nolan, Christopher J. Petti, Gopalkrishna Prabhu, Dominic J. Schepis, Krishna Seshan, Andrew H. Simon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0340d694c3fb323c4272929f5d1b38a0
https://doi.org/10.1016/b978-1-4377-7873-1.00019-x
https://doi.org/10.1016/b978-1-4377-7873-1.00019-x