Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Krishna Mohan Chavali"'
Publikováno v:
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM).
The Semiconductor scaling from planar to recent 3D Vertical FinFET process, have seen better than expected robustness against soft errors, in addition to significant performance and area scaling. This paper presents the SER scaling trends and compari
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::342ca6d06a0c88387ff28996fc757e1c
https://doi.org/10.1109/edtm.2018.8421487
https://doi.org/10.1109/edtm.2018.8421487
Autor:
Krishna Mohan Chavali
Publikováno v:
2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM).
It is important to analyze and understand the soft error rate (SER) scaling and trends when selecting a technology node and process for a product that needs to meet robust SER requirements. In this paper the SER scaling and trends normalized to FITs/
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b273374ccd8a6e720d5842506d397b86
https://doi.org/10.1109/edtm.2017.7947566
https://doi.org/10.1109/edtm.2017.7947566