Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Krishna Lagudu"'
Autor:
H. Aida, E.A. Baisie, D. Boning, L. Borucki, Lee Cook, W. Fan, H. Schumacher-Härtwig, M. Krishnan, U. Künzelmann, Uma Ramesh Krishna Lagudu, Kangchun Lee, Z.C. Li, M.F. Lofaro, Y. Moon, J. Nalaskowski, P. Ong, Ungyu Paik, Jin-Goo Park, K. Pate, N.K. Penta, A. Philipossian, Nagendra Prasad Yerriboina, S.S. Papa Rao, Dipankar Roy, P. Safier, Y. Sampurno, Jihoon Seo, Z. Song, D.E. Speed, L. Teugels, S. Theng, Wei-Tsu Tseng, M. Tsujimura, L. Wang, Q. Zhang, X.H. Zhang, G. Zwicker
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::161388f8245624726dc0a25d71cd0c91
https://doi.org/10.1016/b978-0-12-821791-7.00092-7
https://doi.org/10.1016/b978-0-12-821791-7.00092-7
Autor:
R. Popuri, Charan V. V. S. Surisetty, Uma Rames Krishna Lagudu, Suryadevara V. Babu, S. R. Alety, Raghuveer R. Patlolla
Publikováno v:
ECS Journal of Solid State Science and Technology. 6:P671-P680
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7424e9c7dd01e771f0e915a84329f92
https://doi.org/10.1149/2.0351709jss
https://doi.org/10.1149/2.0351709jss
Autor:
Jaimie Stomberg, Qilin Chan, Brian T. Mader, Mark Ellefson, David Muradian, Larry Zazzera, Alexander Simpson, Uma Rames Krishna Lagudu
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
This work describes advanced metrology based on Single Particle Inductively Coupled Plasma Mass Spectrometry (sp- ICP-MS) used in chemical mechanical planarization (CMP) process development. sp-ICP-MS was used to measure concentrations and sizes of c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27e68bf25003f6186c082ea2e005bd8a
https://doi.org/10.1109/asmc.2019.8791782
https://doi.org/10.1109/asmc.2019.8791782
Autor:
Lehuu Duy K, Larry Zazzera, Jaimie Stomberg, Qilin Chan, Brian T. Mader, Chris Loesch, Alexander Simpson, David Muradian, Uma Rames Krishna Lagudu
Publikováno v:
ECS Journal of Solid State Science and Technology. 10:034009
This work describes the use of Single Particle Inductively Coupled Plasma Mass Spectrometry (spICP-MS) to measure ceria particle number concentrations and compare changes in size distributions to silicon dioxide wafer removal rates from different che
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::292ec3342e2e02eea2b60aa097b644da
https://doi.org/10.1149/2162-8777/abed9e
https://doi.org/10.1149/2162-8777/abed9e
Autor:
Zazzera, Larry, Qilin Chan, Stomberg, Jaimie, Simpson, Alexander, Loesch, Chris, LeHuu, Duy, Muradian, David, Krishna Lagudu, Uma Rames, Mader, Brian
Publikováno v:
ECS Journal of Solid State Science & Technology; Mar2021, Vol. 10 Issue 3, p161-167, 7p
Autor:
Pattabi Rama, V Bhanumathy, Someswara Rao Nittala, Mohana Krishna Lanka, Lalitha Mallikarjun, Krishna Lagudu, Ajay Bikkina
Publikováno v:
Noise & Vibration Worldwide. 45:19-27
Traffic noise is one of the major factors causing noise pollution in schools, interfering with learning and teaching activities. School going children are reported to have difficulty in processing the acoustic signals that are presented in noisy envi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b41d5e94d20333d6a6c474aca388a114
https://doi.org/10.1260/0957-4565.45.11.19
https://doi.org/10.1260/0957-4565.45.11.19
Publikováno v:
Colloids and Surfaces A: Physicochemical and Engineering Aspects. 445:119-127
Silicon carbide thin films, though of widespread use in microelectronic engineering, are difficult to process by chemical mechanical polishing (CMP) because of their hardness and chemical inertness. This report discusses the development of slurries b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d06f06345fd3952250de8778dbf0edbb
https://doi.org/10.1016/j.colsurfa.2014.01.038
https://doi.org/10.1016/j.colsurfa.2014.01.038
Publikováno v:
ECS Journal of Solid State Science and Technology. 3:P219-P225
We show here that transition metal compounds when used as additives to silica dispersions enhance a-SiC removal rates (RRs). Silica slurries containing KMnO4 gave RRs as high as 2000 nm h−1 at pH 4. Addition of CuSO4 to this slurry further enhanced
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7f6d85b44bd1a66e9a8191492c2c93a
https://doi.org/10.1149/2.021406jss
https://doi.org/10.1149/2.021406jss
Autor:
H. P. Amanapu, Ranganath Teki, Uma Rames Krishna Lagudu, Arun John-Kadaksham, Suryadevara V. Babu
Publikováno v:
ECS Transactions. 50:73-79
We describe the effectiveness of depositing an amorphous silicon thin film to cover the existing defects on the surface of extreme ultraviolet (EUV) lithography mask substrates and then polishing the film using abrasive-free liquids. Preliminary inve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0050a26bc9da0dfba25b3eabf65586bb
https://doi.org/10.1149/05039.0073ecst
https://doi.org/10.1149/05039.0073ecst
Autor:
Suryadevara V. Babu, Ranganath Teki, Uma Rames Krishna Lagudu, A. John-Kadaksham, H. P. Amanapu
Publikováno v:
ECS Journal of Solid State Science and Technology. 2:P362-P367
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27230396149a72810434391c2ec11f02
https://doi.org/10.1149/2.015309jss
https://doi.org/10.1149/2.015309jss