Zobrazeno 1 - 10
of 108
pro vyhledávání: '"Kripesh Vaidyanathan"'
Autor:
Sharma, Gaurav, Chong, Ser Choong, Ebin, Liao, Hui, Cai, Gan, Chee Lip, Kripesh, Vaidyanathan
Publikováno v:
In Thin Solid Films 2007 515(7):3315-3322
Autor:
Sivakumar, Mohandass, Kripesh, Vaidyanathan, Ser Choong, Chong, Tai Chong, Chai, Aik Lim, Loon
Publikováno v:
In Microelectronics Reliability 2002 42(9):1535-1540
Autor:
Nah, Jae-Woong, Suh, J. O., Tu, K. N., Yoon, Seung Wook, Rao, Vempati Srinivasa, Kripesh, Vaidyanathan, Hua, Fay
Publikováno v:
Journal of Applied Physics; 12/15/2006, Vol. 100 Issue 12, p123513, 5p, 2 Color Photographs, 1 Black and White Photograph, 3 Diagrams
Autor:
Pinjala Damaruganath, M Ravi, John H. Lau, Ebin Liao, Vempati Srinivasa Rao, Nagarajan Ranganathan, Hong Yu Li, Yen Yi Germaine Hoe, Jiangyan Sun, Xiaowu Zhang, Eva Wai, Tai Chong Chai, C. J. Vath, C. S. Selvanayagam, Y Tsutsumi, Yue Ying Ong, Shiguo Liu, Kripesh Vaidyanathan
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:660-672
The continuous push for smaller bump pitch interconnection in line with smaller Cu/low-k technology nodes demands the substrate technology to support finer interconnection. However, the conventional organic buildup substrate is facing a bottleneck in
Publikováno v:
Advanced Materials Research. 254:62-65
Various breakthroughs have being made recently in Capsule endoscopy (CE). As the technology gets more matured with more clinical acceptance rate, it’s time to explore the best way for fabricating, packaging and integrating the CE. This paper will p
Publikováno v:
Advanced Materials Research. 254:99-102
Capsule endoscopy is a medical procedure to painlessly image the Gastro intestinal tract for the diagnosis of small intestine mucosa. Present capsule endoscopy does not comprise an effective method to localize and tag the abnormalities in gastrointes
Autor:
Xuefen Ong, Seung Uk Yoon, Juan Boon Tan, John H. Lau, Yue Ying Ong, Lim Yeow Kheng, Kai Chong Chan, David Yeo, Dong Kyun Sohn, Yanfeng Zhang, Xiaowu Zhang, J. Ong, Soon Wee Ho, Kripesh Vaidyanathan, V. N. Sekhar
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:279-290
This paper presents a systematic underfill selection and characterization methods for 21 ×21 mm2 Cu/low-K flip chip packages (65 nm technology) with 150 μm bump pitch. This paper has also correlated the underfill characterization methods with the r
Autor:
Teck Guan Lim, Gaurav Sharma, Xianghua Xiao, Srinivasa Rao Vempati, Shiguo Liu, Jinglin Shi, Kripesh Vaidyanathan, Ying Ying Lim, John H. Lau, Aditya Kumar, Nandar Su
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:1061-1071
With the increasing demand for system integration to cater to continuously increasing number of I/Os as well as higher operating frequencies, reconfigured wafer-level packaging, or embedded WLP (EMWLP) is emerging as a promising technology for integr
Autor:
Xiaowu Zhang, John H. Lau, David Yeo, Xuefen Ong, Samuel Lim Yak Long, Vempati Srinivasa Rao, Yoon Uk Seung, V. N. Sekhar, Soon Wee Ho, Kripesh Vaidyanathan, Jimmy Ong, Juan Boon Tan, Ming Chinq Jong, Leong Ching Wai, Yue Ying Ong, Kai Chong Chan, Dong Kyun Sohn, Zhang Yanfeng, Y.K. Lim, Vincent Lee Wen Sheng
Publikováno v:
Microelectronics Reliability. 50:986-994
This paper reports the design, assembly and reliability assessment of 21 × 21 mm 2 Cu/low- k flip chip (65 nm node) with 150 μm bump pitch and high bump density. To reduce the stress from the solder bump pad to low- k layers, Metal Redistribution L
Autor:
Siow Pin Tan, Damaruganath Pinjala, Ai Bin Yu, Kripesh Vaidyanathan, John H. Lau, Kok Chuan Toh, N. Khan, Gongyue Tang
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 33:184-195
In this paper, an integrated liquid cooling system for 3-D stacked modules with high dissipation level is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhi