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Positron annihilation lifetime spectroscopy study of self-assembled porous low-k films

Autor: Kraatz, M., Clausner, A., Gall, M., Zschech, E., Liedke, M. O., Anwand, W., Wagner, A., Krause-Rehberg, R., Pakbaz, K.

Publikováno v: 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics – Experiment and Simulation, 30.05.-01.06.2016, Bad Schandau, Germany

We investigated advanced, self-assembled, porous organosilicate glasses with varying porogen level, resulting in varying dielectric constants (k-values ranging from 1.8 to 2.7, including a non-porous reference sample with 3.0). We used positron annih

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______4577::e5497874dceb9a7b539978765598d9ee
https://www.hzdr.de/publications/Publ-25025-1

Ikonologie der Identität. Vier Stilkategorien der ägyptischen Bildniskunst

Autor: Kraatz., M. [Hrsg.], Meyer Zur Capellen, J. [Hrsg.], Seckel, D. [Hrsg.]

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fc2e8f1ef33c5b68d118b85fe08a041f

Scaling effects on microstructure and reliability for Cu interconnects

Autor: Ho, P.S., Zschech, E., Schmeißer, D., Meyer, M.A., Hübner, R., Hauschildt, M., Zhang, L., Gall, M., Kraatz, M.

Continuous scaling of Cu interconnect structures can significantly impact reliability-limiting processes such as electromigration and stress-induced voiding. Prior to the 65 nm technology node, mass transport under electromigration is dominated by di

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______610::1b7a765042e1ce95d045346d89d08d13
https://publica.fraunhofer.de/handle/publica/223901

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