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Autor:
Gatner, D., Pietrucha, K., Dziergas, B., Nowak, A., Kowalcze, D., Łonski, W., Spilka, M., Kciuk, M.
Publikováno v:
Metalurgija
Volume 62
Issue 3-4
Volume 62
Issue 3-4
Electrodeposition of multilayers continues to grow and diversify. Research is still underway on the adaptation of multilayer systems to new applications in various industries. Cu/Ni multilayers are still very commonly used for practical purposes. In