Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Koung Suk Kim"'
Publikováno v:
The Korean Society of Manufacturing Process Engineers. 19:19-28
Publikováno v:
Journal of the Korean Society for Nondestructive Testing. 34:18-22
Residual stresses that occur during the welding process, are the main cause of failure and defects in welded structures. This paper, presents the use of an electronic processing laser speckle interferometer to measure the residual stress of a welded
Publikováno v:
NDT & E International. 41:119-124
This paper describes the quantitative determination of the sizes and locations of subsurface defects using lock-in infrared thermography. A phase (or temperature) difference between the defect area and the healthy area indicates the qualitative locat
Publikováno v:
Optics & Laser Technology. 39:449-452
The paper proposes an evaluation technique for the elastic modulus of a cantilever beam by vibration analysis based on time average electronic speckle pattern interferometry (TA-ESPI) and Euler–Bernoulli equation. General approaches for the measure
Publikováno v:
Key Engineering Materials. :112-115
Shearography, a type of speckle interferometry, is a powerful tool for nondestructive testing (NDT) because it is insensitive to environmental vibration disturbance and easy to detect strain concentration in an internal defect with noncontact and who
Autor:
Koung Suk Kim, Hyun-Chul Jung
Publikováno v:
Key Engineering Materials. :95-98
The stroboscopic phase shifting ESPI (SPS-ESPI), one of the optical vibration amplitude measurement techniques, is presented. Although the general PS-ESPI can be used for quantitative deformation measurement of the object, this technique cannot measu
Publikováno v:
Key Engineering Materials. :183-188
CFRP composite materials widely used as structural materials for airplanes, ships and aero space vehicles because of their high strength and stiffness. This study aims to investigate the effects of curvature and stacking sequence on the penetration c
Publikováno v:
Journal of Mechanical Science and Technology. 19:820-825
This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively inspection system consists of ESPI system, thermal loading system and adrabatic chamber. The technique has high feasibility in non-d
Publikováno v:
KSME International Journal. 18:1493-1499
This paper describes the speckle shearing interferometry, a non-destructive optical method, for quantitative estimation of void defect and monitoring separation defect inside of a pneumatic tire. Previous shearing interferometry has not supplied quan
Publikováno v:
Key Engineering Materials. :775-780