Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Kouichi Fukaya"'
Autor:
Shuuji Kunisaki, Shigeru Tominaga, Kouichi Fukaya, Seiichi Kondo, Kouji Yamada, Masahisa Fujita, Taro Enomoto, Tadakazu Miyazaki, Daisuke Abe
Publikováno v:
Microelectronic Engineering. 84:2615-2619
Both chemical and mechanical damages to porous SiOC film should be minimized in the Cu-CMP (chemical mechanical polishing) process for the 32-45nm node Cu interconnect process. This paper first discusses chemical damage that occurs during direct CMP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8c1ca0d4c17c9d97c2a28a078c82ac0
https://doi.org/10.1016/j.mee.2007.05.036
https://doi.org/10.1016/j.mee.2007.05.036
Autor:
Kouichi Fukaya, Manabu Tsujimura
Publikováno v:
The Proceedings of Conference of Kanto Branch. :257-258
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3db1e4b89a8c36b61f1d47864c0936e
https://doi.org/10.1299/jsmekanto.2007.13.257
https://doi.org/10.1299/jsmekanto.2007.13.257