Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Kou-Ning Chiang"'
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Artificial intelligence techniques have been widely applied in many domains, such as image /sound/text recognition, manufacturing monitoring, etc. One of the requirements for an artificial intelligence modeling is massive datasets. However, it is oft
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 2:578-586
A high-concentration photovoltaic (HCPV) system with high optic-electric transition efficiency was developed in order to increase the electrical energy generated by a photovoltaic system. However, device temperature rises quickly because of the solar
Publikováno v:
Microelectronics Reliability. 51:1757-1761
Silicon oxide material, which has low-refractive index and high isolation characteristic, has been extensively adopted into high-brightness LED structures. However, the interfacial delamination problem between GaP and SiO2 was observed in the high-br
Publikováno v:
IEEE Transactions on Advanced Packaging. 28:387-396
A robust and rapid development procedure for a novel three-dimensional stacking wafer level chip-scaled packaging (3DS-WLCSP), emphasizing the finite-element parametric analysis and experimental validation, is disclosed herein. This design procedure
Autor:
Chang-An Yuan, Kou-Ning Chiang
Publikováno v:
Journal of Electronic Packaging. 125:576-581
to the full-scaled model, and the flexibility in modeling the entire assembly associated with the area array electronic packaging. However, these authors’ work is restricted to the BGA type packaging solder joint with the same upper/lower pad size,
Publikováno v:
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The purpose of this research is to enhance the structure of the 204-pin small outline dual in-line memory module (SODIMM) against the drop impact. According to the JEDEC regulations, the enhancement of PCB clips should be attempted to increase the re
Publikováno v:
2007 International Conference on Electronic Materials and Packaging.
The demand for energy resources to improve our quality of life continues to increase. However, the prices of Fossil Energy keep going up and the resources are limited. Therefore, more and more reusable energy resources are being developed. The foremo
A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology
Publikováno v:
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
In this study, a new packaging technology, chip-on-metal (COM) panel level package (PLP), is proposed to resolve the problem of assembling a fine-pitched chip to a coarse-pitched substrate. During the manufacturing process, the filler polymer materia
Autor:
Ming-Chih Yew, Chun-Hui Yu, Ching-Shun Huang, Chin-Cheng Yang, Wen-Kung Yang, Kou-Ning Chiang, C.Y. Chou, G.Q. Zhang, Cadmus Yuan
Publikováno v:
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
A novel wafer level chip scaled packaging (WLCSP) having the capability of the redistributing the electrical circuit is proposed herein to resolve the problem of assembling a fine pitched chip to a coarse pitched substrate. In the fan-out WLCSP, the
Autor:
Chin-Cheng Yang, Kou-Ning Chiang, Cheng Nan Han, G.Q. Zhang, Ming-Chih Yew, Chun-Hui Yu, Ching-Shun Huang, Cadmus Yuan, Wen-Kung Yang
Publikováno v:
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
A novel solder on rubber (SOR) structure of the advanced wafer level chip scaled packaging (WLCSP), having the capability of releasing the deformation energy which is caused by the GTE mismatch between the silicon chip and the substrate, is proposed