Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Kosuke Nishigaya"'
Publikováno v:
Separations, Vol 10, Iss 7, p 404 (2023)
Microdevices have been actively implemented in chemical processes, such as in mixing and reactions. However, microseparation devices, excluding extraction devices, are still under development. In distillation, the use of microdevices has been expecte
Externí odkaz:
https://doaj.org/article/9856db015df446e6a2aec5c8c70ee912
Publikováno v:
Applied Mechanics, Vol 2, Iss 1, Pp 16-24 (2021)
Fluidic self-assembly is a versatile on-chip integration method. In this scheme, a large number of semiconductor microchips are spontaneously deposited onto a host chip. The host chip typically comprises a Si substrate with an array of pockets at the
Externí odkaz:
https://doaj.org/article/f0bc864adb44444682025acdf1b3072c
Publikováno v:
PNAS Nexus. 2(3)
Solar cells are a promising optoelectronic device for the simultaneous solution of energy-resource and environmental problems. However, their high cost and slow, laborious production process so far severely hinder a sufficient widespread of clean, re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1ddb5de7af942dafcd817cc936116188
http://hdl.handle.net/2433/281517
http://hdl.handle.net/2433/281517
Publikováno v:
C, Vol 6, Iss 2, p 28 (2020)
A semiconductor bonding technique that is mediated by graphene quantum dots is proposed and demonstrated. The mechanical stability, electrical conductivity, and optical activity in the bonded interfaces are experimentally verified. First, the bonding
Externí odkaz:
https://doaj.org/article/079ba38aed254fc79138a7758d9ccb47
Publikováno v:
Applied Mechanics, Vol 2, Iss 2, Pp 16-24 (2021)
Fluidic self-assembly is a versatile on-chip integration method. In this scheme, a large number of semiconductor microchips are spontaneously deposited onto a host chip. The host chip typically comprises a Si substrate with an array of pockets at the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4165ba27c21382e0982d89241fcb438
https://www.mdpi.com/2673-3161/2/1/2
https://www.mdpi.com/2673-3161/2/1/2
Publikováno v:
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Fluid self-assembly is one of the promising methods for bonding and integrating micron-order optoelectronic devices on semiconductor chips. In this study, we investigated the fluid self-assembly process using an unprecedented Si thin film and quantit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ef7d95050b35f22665c872c02ff7537
https://doi.org/10.1109/ltb-3d53950.2021.9598442
https://doi.org/10.1109/ltb-3d53950.2021.9598442
Publikováno v:
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Semiconductor wafer bonding, mediated by upconversion materials, is proposed and demonstrated. Upconversion is a process that converts long wavelength light into short wavelength light, and is expected to be applied to a variety of optoelectronic dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de9a27a5eb0b1d9274950e13bd82cae6
https://doi.org/10.1109/ltb-3d53950.2021.9598362
https://doi.org/10.1109/ltb-3d53950.2021.9598362
Publikováno v:
Applied Physics Letters. 121:011601
Efficient use of incident sunlight is an important key issue for the improvement of solar cell performance. Here, we propose and experimentally demonstrate photon upconversion material mediated semiconductor bonding as a concept of interfacial functi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::720840324577756e2962cecd3a608d0a
https://doi.org/10.1063/5.0097427
https://doi.org/10.1063/5.0097427
Publikováno v:
2020 47th IEEE Photovoltaic Specialists Conference (PVSC).
A new concept of semiconductor wafer bonding, mediated by optical-wavelength-converting graphene quantum dots, is proposed and demonstrated. The fabrication scheme provides simultaneous bond formation and interfacial function generation, leading to e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cade60193d24eb2b93707a347fa345c5
https://doi.org/10.1109/pvsc45281.2020.9300676
https://doi.org/10.1109/pvsc45281.2020.9300676
Publikováno v:
C, Vol 6, Iss 28, p 28 (2020)
A semiconductor bonding technique that is mediated by graphene quantum dots is proposed and demonstrated. The mechanical stability, electrical conductivity, and optical activity in the bonded interfaces are experimentally verified. First, the bonding
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::71755c3e46b4e3caa18b1514ee942a02
https://www.mdpi.com/2311-5629/6/2/28
https://www.mdpi.com/2311-5629/6/2/28