Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Kooi Chi Ooi"'
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
This paper explores the electrical performance of several multi-channel TSV designs i.e. cross-etched full-plated TSV and cross-etched partial-plated TSV to further improve data transmission bandwidth among the vertically stacked silicon devices. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48c2aecd301f9c8104c3a84cfb3d79ab
https://doi.org/10.1109/eptc.2013.6745684
https://doi.org/10.1109/eptc.2013.6745684
Publikováno v:
2011 3rd Asia Symposium on Quality Electronic Design (ASQED).
A novel enabling technique exploiting interposer approach such as silicon and package interposer [1] in the area of package-on-package (PoP) technology to achieve ultra small form factor packaging solution is presented in this paper. Electrical perfo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6152a9ac990e8c9a08352cbb2032cb54
https://doi.org/10.1109/asqed.2011.6111695
https://doi.org/10.1109/asqed.2011.6111695
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
This paper presents a novel enabling technique exploiting interposer approach such as silicon and package interposer in the area of package-on-package (PoP) technology to achieve ultra small form factor packaging solution. The electrical performance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b4a539df9dae10dd71e72d449748c48
https://doi.org/10.1109/ectc.2011.5898572
https://doi.org/10.1109/ectc.2011.5898572
Publikováno v:
2011 3rd Asia Symposium on Quality Electronic Design (ASQED); 2011, p13-20, 8p
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p589-594, 6p