Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Konrad Futera"'
Publikováno v:
Microelectronics International, 2014, Vol. 31, Issue 3, pp. 212-216.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/MI-10-2013-0047
Efficient Inkjet Printing of Graphene-Based Elements: Influence of Dispersing Agent on Ink Viscosity
Autor:
Lucja Dybowska-Sarapuk, Konrad Kielbasinski, Aneta Arazna, Konrad Futera, Andrzej Skalski, Daniel Janczak, Marcin Sloma, Malgorzata Jakubowska
Publikováno v:
Nanomaterials, Vol 8, Iss 8, p 602 (2018)
Inkjet printing is an excellent printing technique and an attractive alternative to conventional technologies for the production of flexible, low-cost microelectronic devices. Among many parameters that have a significant impact on the correctness of
Externí odkaz:
https://doaj.org/article/a46ae9e1bbde490a89023af1b12ce2be
Publikováno v:
Warsaw University of Technology-OmegaPSIR
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::232b79df54ccf2f3bf93452c82cd6c92
http://www.ise.pw.edu.pl/~rrom/Journals/Elektronika-0033-2089/Elektronika%202009/Elektronika%202009-12.pdf
http://www.ise.pw.edu.pl/~rrom/Journals/Elektronika-0033-2089/Elektronika%202009/Elektronika%202009-12.pdf
Autor:
Łucja Dybowska-Sarapuk, Konrad Futera, Araźna, A., Konrad Kiełbasiński, Malgorzata Jakubowska, Anna Młożniak
Publikováno v:
Warsaw University of Technology-OmegaPSIR
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::11b54360bbff89086073c0a8b2c26008
http://imaps.prz.edu.pl/
http://imaps.prz.edu.pl/
Publikováno v:
IOP Conference Series: Materials Science & Engineering; 1/1/2016, Vol. 104 Issue 1, p1-1, 1p
Publikováno v:
Circuit World; 2017, Vol. 43 Issue 1, p9-12, 4p
Publikováno v:
Microelectronics International; 2016, Vol. 33 Issue 2, p94-101, 8p
Autor:
Stęplewski, Wojciech, Mroczkowski, Mateusz, Darakchiev, Radoslav, Futera, Konrad, Kozioł, Grażyna
Publikováno v:
Circuit World; 2015, Vol. 41 Issue 3, p121-124, 4p
Autor:
Sitek, Janusz, Araźna, Aneta, Janeczek, Kamil, Stęplewski, Wojciech, Lipiec, Krzysztof, Futera, Konrad, Ciszewski, Piotr
Publikováno v:
Soldering & Surface Mount Technology; 2015, Vol. 27 Issue 3, p120-124, 5p
Publikováno v:
Soldering & Surface Mount Technology; 2015, Vol. 27 Issue 3, p108-111, 4p