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Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
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Autor:
Sutter E; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588, USA. esutter@unl.edu., Komsa HP; Microelectronics Research Unit, University of Oulu, FI-90014 Oulu, Finland., Sutter P; Department of Electrical and Computer Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588, USA. psutter@unl.edu.
Publikováno v:
Nanoscale horizons [Nanoscale Horiz] 2024 Sep 23; Vol. 9 (10), pp. 1823-1832. Date of Electronic Publication: 2024 Sep 23.
Autor:
Sheng J; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland., Kang J; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland., Jiang P; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland.; Research Institute of Wood Industry, Chinese Academy of Forestry, Xiangshan Road, Beijing, 100091, China., Meinander K; Department of Bioproducts and Biosystems, Aalto University, Espoo, FIN-02150, Finland., Hong X; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland., Jiang H; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland., Nonappa; Faculty of Engineering and Natural Sciences, Tampere University, Tampere, FI-33101, Finland., Ikkala O; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland., Komsa HP; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, FIN-90014, Finland., Peng B; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland.; Department of Materials Science, Advanced Coating Research Center of Ministry of Education of China, Fudan University, Shanghai, 200433, China., Lv ZP; Department of Applied Physics, Aalto University, ESPOO, FIN-02150, Finland.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2024 Sep 10, pp. e2404927. Date of Electronic Publication: 2024 Sep 10.
Autor:
Berger E; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, Oulu FIN-90014, Finland., Niemelä J; Faculty of Biochemistry and Molecular Medicine, University of Oulu, Oulu FIN-90014, Finland., Lampela O; Biocenter Oulu and Faculty of Biochemistry and Molecular Medicine, University of Oulu, Oulu FIN-90014, Finland., Juffer AH; Biocenter Oulu and Faculty of Biochemistry and Molecular Medicine, University of Oulu, Oulu FIN-90014, Finland., Komsa HP; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, Oulu FIN-90014, Finland.
Publikováno v:
Journal of chemical information and modeling [J Chem Inf Model] 2024 Jun 24; Vol. 64 (12), pp. 4601-4612. Date of Electronic Publication: 2024 Jun 03.
Autor:
Bagheri M; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu FIN-90014, Finland., Berger E; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu FIN-90014, Finland., Komsa HP; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu FIN-90014, Finland.
Publikováno v:
The journal of physical chemistry letters [J Phys Chem Lett] 2023 Sep 07; Vol. 14 (35), pp. 7840-7847. Date of Electronic Publication: 2023 Aug 25.
Autor:
Sutter P; Department of Electrical & Computer Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska 68588, United States., Komsa HP; Microelectronics Research Unit, University of Oulu, FI-90014 Oulu, Finland., Kisslinger K; Center for Functional Nanomaterials, Brookhaven National Laboratory, Upton, New York 11973, United States., Sutter E; Department of Mechanical & Materials Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska 68588, United States.
Publikováno v:
ACS nano [ACS Nano] 2023 May 23; Vol. 17 (10), pp. 9552-9564. Date of Electronic Publication: 2023 May 05.
Autor:
Hosseini-Shokouh SH; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, FIN-90014Oulu, Finland., Zhou J; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, FIN-90014Oulu, Finland., Berger E; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, FIN-90014Oulu, Finland., Lv ZP; Department of Applied Physics, Aalto University, FIN-00076Aalto, Finland., Hong X; Department of Applied Physics, Aalto University, FIN-00076Aalto, Finland., Virtanen V; Research Unit of Medical Imaging, Physics and Technology, Faculty of Medicine, University of Oulu, Aapistie 5A, 90220Oulu, Finland., Kordas K; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, FIN-90014Oulu, Finland., Komsa HP; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, FIN-90014Oulu, Finland.
Publikováno v:
ACS applied materials & interfaces [ACS Appl Mater Interfaces] 2023 Feb 08; Vol. 15 (5), pp. 7063-7073. Date of Electronic Publication: 2023 Jan 24.
Autor:
Bagheri M; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, FIN-90014, Finland., Komsa HP; Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, Oulu, FIN-90014, Finland. hannu-pekka.komsa@oulu.fi.
Publikováno v:
Scientific data [Sci Data] 2023 Feb 08; Vol. 10 (1), pp. 80. Date of Electronic Publication: 2023 Feb 08.
Autor:
Sutter E; Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska68588, United States.; Nebraska Center for Materials and Nanoscience, University of Nebraska-Lincoln, Lincoln, Nebraska68588, United States., Komsa HP; Faculty of Information Technology and Electrical Engineering, University of Oulu, FI-90014, Oulu, Finland., Puretzky AA; Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, Tennessee37830, United States., Unocic RR; Center for Nanophase Materials Sciences, Oak Ridge National Laboratory, Oak Ridge, Tennessee37830, United States., Sutter P; Department of Electrical and Computer Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska68588, United States.
Publikováno v:
ACS nano [ACS Nano] 2022 Dec 27; Vol. 16 (12), pp. 21199-21207. Date of Electronic Publication: 2022 Nov 22.