Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology

Autor: Veale, Matthew C., Booker, P., Church, I., Jones, L. L., Lipp, J., Schneider, Andreas, Seller, Paul H., Wilson, Matthew D., Chsherbakov, Ivan, Kolesnikova, Irina I., Lozinskaya, Anastassiya D., Novikov, Vladimir A., Tolbanov, Oleg P., Tyazhev, Anton V., Zarubin, Andrei N.

Publikováno v: Nuclear instruments and methods in physics research Section A: accelerators, spectrometers, detectors and associated equipment. 2022. Vol. 1025. P. 166083 (1-9)

In this paper a new version of the HEXITEC spectroscopic imaging technology is presented. The HEXITEC ASIC maintains the same pixel electronics but, unlike the previous design, contains no I/O pads on the top surface of the ASIC. The I/O pads, used f

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od______3810::5e56e6bc3e3b4aa167604b377ead9865
https://vital.lib.tsu.ru/vital/access/manager/Repository/koha:000997249

The visibility and stability of GaSe nanoflakes of about 50 layers on SiO2/Si wafers.

Autor: Redkin, Ruslan A., Kobtsev, Daniil A., Kolesnikova, Irina I., Bereznaya, Svetlana, Sarkisov, Yury, Voevodin, Vladimir, Novikov, Vadim, Mihaylov, Timofei, Sarkisov, Sergey Yu.

Publikováno v: International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics; 10/30/2021, Vol. 35 Issue 27, p1-14, 14p