Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Kokou Adokanou"'
Autor:
J.-L. Muraro, Francis Pressecq, Kokou Adokanou, Karim Inal, Barbara Bonnet, Pierre Montmitonnet
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis-Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩
Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis-Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩
International audience; Stress control is a main factor in the operation, performance and reliability of GaAs devices. A precise understanding of the impact of the mechanical stress on the performance and reliability of GaAs devices can lead to the i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::79f88cd57c4dd99a2f9f19fe2e9d74ce
https://hal-mines-paristech.archives-ouvertes.fr/hal-01180774
https://hal-mines-paristech.archives-ouvertes.fr/hal-01180774
Publikováno v:
Proceedings EuroSimE 2015
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p.-ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015
16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems-EuroSimE 2015, Apr 2015, Budapest, Hungary. 8 p.-ISBN 978-1-4799-9949-1 ⟨10.1109/EuroSimE.2015.7103140⟩
International audience; Accelerated life tests on microelectronic devices are needed to estimate their degradation under severe environment. THB (Temperature Humidity Bias) [1] at 85°C and 85%RH (relative humidity) is commonly used for reliability s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::33a92005942fd64486fe05ee042094d7
https://doi.org/10.1109/eurosime.2015.7103140
https://doi.org/10.1109/eurosime.2015.7103140
