Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Koki, Onishi"'
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Low-temperature deposited PE-CVD SiCN has been comprehensively investigated towards the dielectric layer of Die-to-Wafer hybrid bonding. The PECVD SiCN was deposited at room temperature. The characterization of the deposited film and the impact of th
Publikováno v:
Journal of Japan Society of Civil Engineers, Ser. B2 (Coastal Engineering). 78:I_913-I_918
Publikováno v:
Journal of Japan Society of Civil Engineers, Ser. B3 (Ocean Engineering). 78:I_697-I_702
Autor:
Masahiro Takaiwa, Koki Onishi
Publikováno v:
The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec). 2019:2A1-C15
Autor:
Robert M. Delinom, Mitsuyo Saito, Hendra Bakti, Shin-ichi Onodera, Rachmat Fajar Lubis, Yuta Shimizu, Koki Onishi
Publikováno v:
Journal of Japanese Association of Hydrological Sciences. 43:39-46
Publikováno v:
Japanese Journal of Limnology (Rikusuigaku Zasshi). 75:1-11
Autor:
Koki Onishi, Toshiyuki Takahashi, Erina Iseri, Tomohiro Kuwae, Mitsuharu Toba, Yoshihiro B. Akiyama, Tomonari Okada, Yugo Mito, Minoru Yoshida, Kenta Watanabe
Publikováno v:
Journal of Japan Society of Civil Engineers, Ser. B2 (Coastal Engineering). 71:I_1483-I_1488