Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Kok-Cheng Chong"'
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7944d77591373dda65432875f0bad2c3
https://doi.org/10.1109/ipfa55383.2022.9915741
https://doi.org/10.1109/ipfa55383.2022.9915741
Publikováno v:
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b01348bfea5b93cfe180b28e6750cbd9
https://doi.org/10.1109/ipfa53173.2021.9617360
https://doi.org/10.1109/ipfa53173.2021.9617360
Publikováno v:
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Energy Dispersive X-ray (EDX) is a commonly used tool for elemental analysis in failure analysis for years. EDX tool can perform qualitative and quantitative elemental analysis to identify various chemical elements and characterize the material prope
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d09cf238fff2bf7c7842e64838740b8
https://doi.org/10.1109/ipfa49335.2020.9260662
https://doi.org/10.1109/ipfa49335.2020.9260662
Publikováno v:
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).
We live in, move through, and see in a world of three dimensions (3D). The 3D visual observation of the milieu around us is based on 2D images projected onto our retina. The 3D stereoscopic capability renders spatial information and enables us to gai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3dc0e062f2dd0554085fb9fcd908a42
https://doi.org/10.1109/ipfa47161.2019.8984797
https://doi.org/10.1109/ipfa47161.2019.8984797
Publikováno v:
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Electron beam-induced contamination is one of the annoying problems in scanning electron microscopy (SEM) inspection process. When electron beam continuously scans the specimen surface, hydrocarbon molecules (from vacuum pump) in the chamber or on th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3eb149f78d20f2d7525ee8408a12635
https://doi.org/10.1109/ipfa.2018.8452605
https://doi.org/10.1109/ipfa.2018.8452605
Publikováno v:
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
3-Dimentional (3D) X-ray imaging significantly increases the visibility of the bond wires and lead frame structures of the complicated integrated circuits (IC) packages, particularly for the less visible Copper (Cu) bond wires used in more recent IC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e453d5ce95b3b8e3aa503514c7907c6
https://doi.org/10.1109/ipfa.2017.8060108
https://doi.org/10.1109/ipfa.2017.8060108
Publikováno v:
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Driven by the next generation of electronic devices that require progressive miniaturization, stacked die packages have been developed to provide greater functionality in smaller package footprints. This provides a substantial improvement in the elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77ff7db6cce1d79b37edfb6bc8a40749
https://doi.org/10.1109/ipfa.2016.7564239
https://doi.org/10.1109/ipfa.2016.7564239
Autor:
Kok-Cheng Chong, Ercan Adem, Bryan Tracy, Amalia del Rosario, Lai-Seng Yeoh, Chee-Wah Tam, Susan Li
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.
Traditional mechanical sample preparation via grinding and polishing not only can cause surface deformation that obscures the original property of the material, but it also can induce secondary contamination that affects the analysis accuracy. In thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::689afe1066496f4b2cd6c9b7459c7ac1
https://doi.org/10.1109/ipfa.2015.7224431
https://doi.org/10.1109/ipfa.2015.7224431
Publikováno v:
Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d199f2f6b7596f3a94eccb39cd2dd79
https://doi.org/10.1109/ipfa.2014.6898138
https://doi.org/10.1109/ipfa.2014.6898138
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Intermetallic (IMC) is an alloy formed between two or more metals. Understanding IMC growth and formation is important in determining the bond integrity and the conductivity between metals. While Au-Al IMC is easily detected, Cu-Al IMC is hardly seen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef03b419811637c7f6c33286963d8ae7
https://doi.org/10.1109/eptc.2013.6745701
https://doi.org/10.1109/eptc.2013.6745701