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Publikováno v:
Chemical Engineering Research and Design. 103:123-129
Tombstoning is a common defect that occurs due to the uneven heating of the solder paste during the soldering process of surface-mount devices (SMDs) on circuit boards. With electronics becoming smaller in size and lighter in weight, SMDs will contin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::252d65070d681905bcf6dbe8f4efb003
https://doi.org/10.1016/j.cherd.2015.09.012
https://doi.org/10.1016/j.cherd.2015.09.012
Autor:
Sing Sheng Lim, Issac1 issaclss@gmail.com, Chin Yau Chung, Edwin2, Boon Thong Tan, Kenny1, Kok Soo Teoh3
Publikováno v:
Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A. Nov2015, Vol. 103, p123-129. 7p.