Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Koji Takayanagi"'
Publikováno v:
Journal of Japan Association on Odor Environment. 49:180-186
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d92c2c610895647338a7660330c0cf0
https://doi.org/10.2171/jao.49.180
https://doi.org/10.2171/jao.49.180
Publikováno v:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 6:364-372
Design techniques for 3-D SoC stacked with a Wide I/O DRAM with through silicon via (TSV) technology were developed. Some of the developed techniques were applied to design a Wide I/O DRAM controller chip. Micro-I/O cells and area efficient decouplin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f281c8c0fd37c18c3c34c299d0ae14e6
https://doi.org/10.1109/jetcas.2016.2547719
https://doi.org/10.1109/jetcas.2016.2547719
Autor:
Takao Nomura, Tsuyoshi Kida, Kazuki Fukuoka, Koji Nii, Sadayuki Morita, Kentaro Mori, Toshihiko Ochiai, Ryo Mori, Koji Takayanagi
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP).
A Wide IO DRAM controller chip with Through Silicon Via (TSV) technology is implemented. Test circuitry for prebonding TSV tests are embedded in between the fine pitch TSVs. In order to reduce Vmin degradation induced by 512 DQs simultaneously switch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce7a1146a1c1408c62b3ed3e80405d71
https://doi.org/10.1109/icep.2014.6826722
https://doi.org/10.1109/icep.2014.6826722
Autor:
Koji Takayanagi, Yoshiharu Nakamura
Publikováno v:
IEEJ Transactions on Fundamentals and Materials. 121:471-476
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2970bb71ff7c27a07438904316f28d80
https://doi.org/10.1541/ieejfms1990.121.5_471
https://doi.org/10.1541/ieejfms1990.121.5_471
Autor:
Tsuyoshi Kida, Kazuki Fukuoka, Junichi Yamada, Takao Nomura, Hideki Tanaka, Tomoaki Hashimoto, Munehiro Ito, Koji Takayanagi, Koji Nii, Ryo Mori, Sadayuki Morita, Kazuo Otsuga, Toshihiko Ochiai
Publikováno v:
CICC
We developed a Wide IO DRAM controller chip with Through Silicon Via (TSV) technology. Test circuitry is embedded in the micro-IOs placed between the fine pitch TSVs which can reject TSV connectivity failures prior to stacking process. In order to re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::756601bbb282959c036141bcfbd69d5a
https://doi.org/10.1109/cicc.2013.6658415
https://doi.org/10.1109/cicc.2013.6658415
Autor:
Koji Takayanagi, Ryouichi Uemura, Tomohiro Iseki, Kosuke Yoshihara, Yuichi Yoshida, Hiroshi Marumoto, Keiichi Tanaka
Publikováno v:
SPIE Proceedings.
Defect reduction has become one of the most important technical challenges in device mass-production. Knowing that resist processing on a clean track strongly impacts defect formation in many cases, we have been trying to improve the track process to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7390e4c5a58adf9cb41b2841a60965ad
https://doi.org/10.1117/12.915813
https://doi.org/10.1117/12.915813
Autor:
Takahiro Okubo, Kouzo Nishi, Koji Takayanagi, Toshinobu Furusho, Kosuke Yoshihara, Tsuyoshi Shibata, Yusuke Yamamoto
Publikováno v:
SPIE Proceedings.
As pattern size becomes smaller, requirement for defect reduction is getting higher and higher. It is known that defects occur in various steps of lithography process. In this study, we focus on defects related to the resist dispense system. Of those
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e0d7a814471d2633623b89c17af04c4
https://doi.org/10.1117/12.879339
https://doi.org/10.1117/12.879339
Autor:
Jun-ichi Onodera, Hiroyuki Watanabe, Shingo Sato, Koji Takayanagi, Heitaro Obara, Kimio Furuhata, Shigeru Matsuba, Toshihiro Kumazawa
Publikováno v:
ChemInform. 33
Carthamin acetate, (3S,3′S)-1-[5-(p-acetoxycinnamoyl)-3-C-(β-D-2″,3″,4″,6″-tetra-O-acetylglucopyranosyl)-3,4-dihydroxy-2,6-diketo]cyclohex-4-enylidene-1′-[5′-(p-acetoxycinnamoyl)-3′-C-(β-D-2″′,3″′,4″′, 6″′-tetra-O-ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::daf9ed83a72e1b84b3367e4c305249c0
https://doi.org/10.1002/chin.200219163
https://doi.org/10.1002/chin.200219163
Autor:
Kimio Furuhata, Jun-ichi Onodera, Hiroyuki Watanabe, Shigeru Matsuba, Shingo Sato, Koji Takayanagi, Heitaro Obara, Toshihiro Kumazawa
Publikováno v:
Chemistry Letters. 30:1318-1319
Carthamin acetate, (3S,3′S)-1-[5-(p-acetoxycinnamoyl)-3-C-(β-D-2″,3″,4″,6″-tetra-O-acetylglucopyranosyl)-3,4-dihydroxy-2,6-diketo]cyclohex-4-enylidene-1′-[5′-(p-acetoxycinnamoyl)-3′-C-(β-D-2″′,3″′,4″′, 6″′-tetra-O-ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c70edcf7b08c68f1fb480fc3d4c95906
https://doi.org/10.1246/cl.2001.1318
https://doi.org/10.1246/cl.2001.1318