Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Kohzoh Abe"'
Publikováno v:
Precision Engineering. 52:84-93
Recently, a multi-wire electrical discharge slicing (EDS) process has been proposed for slicing SiC ingots into wafers. A significant reduction in kerf loss is expected with this method compared with the conventional multi-wire saw method. However, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e43dc6eeb0346ae488034829a77e0f2f
https://doi.org/10.1016/j.precisioneng.2017.11.012
https://doi.org/10.1016/j.precisioneng.2017.11.012
Publikováno v:
Precision Engineering. 49:33-40
Electrical discharge machining by foil electrode serves as an alternative method for SiC slicing. This technology uses a highly tensioned thin foil as the tool electrode. The main advantages over wire EDM are that the foil thickness can be made small
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35559b0810934a29dc119475fb1619f9
https://doi.org/10.1016/j.precisioneng.2017.01.007
https://doi.org/10.1016/j.precisioneng.2017.01.007
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 86:2905-2912
Slicing of single crystal silicon carbide (SiC) wafers by commonly used abrasive wire saw method is very time and cost consuming due to its extreme high hardness. This problem becomes more serious with the increase of SiC ingot diameter. Therefore, e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6cbfdb50f805e2aad581f4321504a065
https://doi.org/10.1007/s00170-016-8412-z
https://doi.org/10.1007/s00170-016-8412-z
Publikováno v:
Procedia CIRP. 42:185-190
Single crystal silicon carbide is a promising material for producing next-generation power electronic devices owing to its outstanding physical properties of wide band gap, high dielectric strength, high heat resistance and high electron saturation d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f903ae8c358db53f2ba4e7357a6524c8
Publikováno v:
Procedia CIRP. 42:601-605
In machining process of WEDM, the gap phenomena are intricately changed by pulse conditions, materials or thickness of workpieces, and the types of wire electrodes. Moreover, the wire vibrates in narrow gap because of electrostatic force, electromagn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5d1cfd40323ff3ff8904e9fd1ffbe18f
https://doi.org/10.1016/j.procir.2016.02.219
https://doi.org/10.1016/j.procir.2016.02.219
Publikováno v:
Precision Engineering. 41:24-31
A new technique of EDM coring of single crystal silicon carbide (SiC) ingot was proposed in this paper. Currently single crystal SiC devices are still of high cost due to the high cost of bulk crystal SiC material and the difficulty in the fabricatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60a184cf6a4608670c5bb53347e93e79
https://doi.org/10.1016/j.precisioneng.2014.12.007
https://doi.org/10.1016/j.precisioneng.2014.12.007
Publikováno v:
Precision Engineering. 40:26-32
This paper describes the observation of EDM gap phenomena through a transparent electrode from the direction normal to the machining surface using a high-speed video camera. To visualize the gap, SiC single crystal was used as the electrode material
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f521cf31903d1e42264e578cba87ad6
https://doi.org/10.1016/j.precisioneng.2014.09.009
https://doi.org/10.1016/j.precisioneng.2014.09.009
Publikováno v:
International Journal of Electrical Machining. 20:53-57
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a3760101c19b41ec760060aad9dc66a
https://doi.org/10.2526/ijem.20.53
https://doi.org/10.2526/ijem.20.53
Publikováno v:
Precision Engineering. 38:92-99
Electrical discharge machining (EDM) is developing as a new alternative method for slicing single crystal silicon carbide (SiC) ingots into thin wafers. Aiming to improve the performance of EDM slicing of SiC wafers, the fundamental characteristics o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9a8eccae69938615cddee6f1b49219d
https://doi.org/10.1016/j.precisioneng.2013.07.008
https://doi.org/10.1016/j.precisioneng.2013.07.008
Publikováno v:
Procedia CIRP. :314-319
In electrical discharge machining (EDM), discharge occurs with a high frequency in a narrow gap space between parallel plane electrodes filled with a dielectric fluid thus making direct observation of electrical discharge phenomena extremely difficul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::305ec7dec653e2971e1e4eef6ddc05b2