Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Kohta Furuyama"'
Publikováno v:
IEEJ Transactions on Sensors and Micromachines. 139:38-39
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc5606b2d97bdf7e033726dde4115b1e
https://doi.org/10.1541/ieejsmas.139.38
https://doi.org/10.1541/ieejsmas.139.38
Publikováno v:
International Journal of Electrical Machining. 21:18-24
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da0323199b9958b5c2f844d2b6274c06
https://doi.org/10.2526/ijem.21.18
https://doi.org/10.2526/ijem.21.18
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
Utilizing hydrogen radicals as a reducing agent, reflow of indium solder paste printed on chips were conducted. Where hydrogen gas treatment failed to form indium solder bumps at 250 C, it was shown indium solder bumps were successfully formed at tem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ea31793bd4b5d2dced9736e76832a9d
https://doi.org/10.1109/icsj.2017.8240140
https://doi.org/10.1109/icsj.2017.8240140
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Hydrogen radicals were used to remove the oxide layer of copper metal. Successful removal of the oxide layer was detected using X-ray photoelectron spectroscopy (XPS), where the visible color change has occurred after the treatment. Period of re-oxid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3cd0091e62f24f245175053b74c58f5c
https://doi.org/10.23919/ltb-3d.2017.7947468
https://doi.org/10.23919/ltb-3d.2017.7947468
Publikováno v:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
This study investigates the effect of hydrogen radical treatment on indium surface oxide removal, and the observation of re-oxidation post treatment. It was found that hydrogen radical treatment successfully removes indium surface oxide at temperatur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21fbd5caff8b8730fc8bfa8b6bf61605
https://doi.org/10.23919/ltb-3d.2017.7947461
https://doi.org/10.23919/ltb-3d.2017.7947461
Publikováno v:
Japanese Journal of Applied Physics. 57:02BC01
Indium is a commonly used metal for sealing, bonding, and soldering due to its good malleability and ductility even at cryogenic temperatures. The effects of hydrogen radical treatment on indium surface oxide removal were evaluated by the spreading r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ee548150ecf057c1554ee99dbe95554
https://doi.org/10.7567/jjap.57.02bc01
https://doi.org/10.7567/jjap.57.02bc01
Publikováno v:
Japanese Journal of Applied Physics; Feb2018, Vol. 57 Issue 2S1, p1-1, 1p