Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Kohei Seyama"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:836-844
Thermal compression bonding (TCB) involves three technology themes: high-speed and high-accuracy motion, substrate–die planarity, and stability for long production runs. We will propose solutions for each of these themes. For high-speed and high-ac
Publikováno v:
Journal of the Japan Society for Precision Engineering. 85:176-181
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
A new, highly productive and accurate thermal compression bonder is presented. Overcoming the disparity between productivity and accuracy, we propose a multi-table and multi-bond head system utilizing gantries, including: a pipeline system to decreas
Publikováno v:
The proceedings of the JSME annual meeting. :11-12
Publikováno v:
Proceedings of thermal engineering conference. 2002:315-316
Publikováno v:
The Proceedings of Yamanashi District Conference. 2002:89-90
Publikováno v:
The Proceedings of Conference of Kanto Branch. :483-484
Publikováno v:
The Proceedings of Yamanashi District Conference. 2001:207-208